Dual Purpose Seal Head Assembly for MAP and VSP Packaging
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Solution Overview
Problem
Conventional packaging machines are limited to either Modified Atmosphere Packaging (MAP) or Vacuum Skin Packaging (VSP) processes, requiring frequent retooling and reducing efficiency when switching between different packaging methods, as they cannot be configured for both processes simultaneously.
Innovation Solution
A tray sealing system with a seal head assembly featuring independently temperature-controlled heat seal plates, air vents, and a controller that allows for different temperature settings and air flow control, enabling the same machine to perform both MAP and VSP processes with a simple recipe change.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a packaging machine is configured for MAP process, then it can perform MAP packaging, but it cannot perform VSP packaging without retooling
Solution Approach 1:
The seal head assembly is designed to perform both MAP and VSP packaging processes using the same physical components. The heating elements can be independently controlled to provide different temperature profiles required for MAP (lower temperature) and VSP (higher temperature), while the air vents can be controlled to maintain atmosphere during MAP or create vacuum during VSP. This multi-functionality eliminates the need for retooling between processes.
Solution Approach 2:
The system dynamically adjusts operating parameters (temperature and air flow) based on the selected packaging process. The controller receives process selection input and dynamically modifies the operation of heating elements and air vents to match the requirements of either MAP or VSP mode, allowing the same hardware to adapt to different packaging needs.
2Adaptability or versatility
If a packaging machine is configured for VSP process, then it can perform VSP packaging, but it cannot perform MAP packaging without retooling
Solution Approach 1:
The seal head assembly is designed to perform both MAP and VSP packaging processes using the same physical components. The heating elements can be independently controlled to provide different temperature profiles required for MAP (lower temperature) and VSP (higher temperature), while the air vents can be controlled to maintain atmosphere during MAP or create vacuum during VSP. This multi-functionality eliminates the need for retooling between processes.
Solution Approach 2:
The system dynamically adjusts operating parameters (temperature and air flow) based on the selected packaging process. The controller receives process selection input and dynamically modifies the operation of heating elements and air vents to match the requirements of either MAP or VSP mode, allowing the same hardware to adapt to different packaging needs.
3Adaptability or versatility
If the machine is retooled frequently to switch between MAP and VSP, then it can adapt to different products, but efficiency is greatly impacted
Solution Approach 1:
The system dynamically adjusts operating parameters (temperature and air flow) based on the selected packaging process. The controller receives process selection input and dynamically modifies the operation of heating elements and air vents to match the requirements of either MAP or VSP mode, allowing the same hardware to adapt to different packaging needs without physical retooling.
Solution Approach 2:
The invention changes operational parameters (temperature settings and air flow rates) rather than physical configuration to switch between processes. The heating elements can be independently controlled to provide different temperature profiles, and the air vents can be controlled to maintain atmosphere or create vacuum, allowing parameter-based adaptation that maintains high productivity.
4Adaptability or versatility
If the machine is retooled frequently, then it can handle different packaging processes, but the risk of machine damage or incorrect retooling increases
Solution Approach 1:
The system dynamically adjusts operating parameters (temperature and air flow) based on the selected packaging process. The controller receives process selection input and dynamically modifies the operation of heating elements and air vents to match the requirements of either MAP or VSP mode, allowing the same hardware to adapt to different packaging needs without physical retooling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for efficient and flexible packaging of products using both MAP and VSP processes without the need for extensive retooling, increasing operational efficiency and reducing the risk of machine damage.
Implementation Method 1
each heat seal plate comprising a heating element to independently control the temperature of the corresponding heating area
Implementation Method 2
at least one of the plurality of heat seal plates includes a cooling element to selectively reduce the temperature of the corresponding heating area independently of other heating areas
Implementation Method 3
at least one of the plurality of heat seal plates includes a plurality of vents to pump air in or out
Data Source
AI summary
A seal head assembly includes a plurality of heat seal plates defining a corresponding plurality of heating areas, each heat seal plate including a heating element to independently control the temperature of the corresponding heating area.