Dual Purpose Wireless Device Packaging Heat Dissipation
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Solution Overview
Problem
The increasing complexity and power consumption in wireless access points lead to overheating issues, which are exacerbated by their small form factor, potentially damaging components and degrading performance.
Innovation Solution
A dual-purpose packaging that functions as both an electrically conductive heat coupler to dissipate heat and an electromagnetic radiation reflector, using co-planar portions to draw heat away from electrical components and dissipate it over a combined surface area while also reflecting EM radiation associated with the antenna.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If wireless APs include increasingly complicated and power hungry hardware to support wireless connectivity, then connectivity coverage and protocol accommodation are improved, but power consumption and heat dissipation increase
Solution Approach 1:
The patent combines the antenna support structure and heat dissipation system into a single integrated packaging structure. The antenna mount is formed as an integral part of the packaging, with heat dissipation features directly incorporated into the same structure, eliminating the need for separate heat management components and reducing overall device complexity while maintaining enhanced connectivity capabilities
Solution Approach 2:
The packaging structure serves multiple functions simultaneously: it provides mechanical support for the antenna, dissipates heat from power-consuming components, and maintains the compact form factor. This multi-functional design allows the device to accommodate complex hardware for broad connectivity while managing the resulting heat dissipation within the same structural envelope
2Volume of moving object
If wireless APs are made small with a discreet form factor, then device compactness is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent utilizes the third dimension by incorporating vertically extending heat dissipation fins into the packaging structure. These fins increase the heat dissipation surface area by extending in the vertical dimension rather than requiring additional horizontal space, allowing effective heat management within a compact footprint while maintaining the discreet form factor
Solution Approach 2:
The heat dissipation features are nested within the existing packaging structure rather than adding external components. The antenna mount and heat dissipation elements are integrated into the same structural envelope, with heat sinks and fins incorporated within the available internal volume, maximizing heat dissipation capability without increasing the external dimensions of the device
3Volume of moving object
If greater heat dissipation is combined with small form factor, then device compactness is maintained, but component damage and performance degradation increase
Solution Approach 1:
The patent introduces thermal interface materials and heat transfer pathways as intermediary elements between heat-generating components and the heat dissipation structure. These intermediaries efficiently conduct heat away from sensitive components to the integrated heat sinks and fins, protecting components from thermal damage while maintaining the compact form factor and preserving reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively manages heat dissipation and electromagnetic radiation, enhancing the reliability and performance of wireless access points by preventing component damage and maintaining a compact form factor.
Implementation Method 1
a second portion of the electrically conductive heat coupler electrically coupled to the first portion, where the second portion is shaped for arrangement in association with the placement of one or more electrical components on a substrate in order to draw heat away from at least one of the one or more electrical components and dissipate the heat over a combined surface area
Implementation Method 2
a first portion of an electrically conductive heat coupler provided for the antenna mount, wherein the first portion of the electrically conductive heat coupler reflects EM radiation associated with the antenna
Data Source
AI summary
In one embodiment, an apparatus includes: an antenna mount provided for an antenna; a first portion of an electrically conductive heat coupler provided for the antenna mount, wherein the first portion of the electrically conductive heat coupler reflects electromagnetic radiation associated with the antenna; and a second portion of the electrically conductive heat coupler electrically coupled to the first portion, where the second portion is shaped for arrangement in association with the placement of one or more electrical components on a substrate in order to draw heat away from at least one of the one or more electrical components and dissipate the heat over a combined surface area of the first and second portions of the electrically conductive heat coupler.