Dual-Radiator Cooling Device Angular Configuration
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Solution Overview
Problem
Cooling devices with a single radiator do not maximize surface area for cooling liquid coolant, leading to suboptimal heat dissipation in server systems, and existing designs may not efficiently transfer heat from high-temperature areas to low-temperature areas.
Innovation Solution
A dual-radiator cooling device is positioned at an angle relative to the server system's bottom panel, with a connecting conduit between the radiators, and includes a fan for airflow and a pump for fluid circulation, enhancing heat dissipation through increased surface area and thermal convection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a single radiator is used in the cooling device, then the device complexity is reduced, but the surface area for heat dissipation is insufficient leading to suboptimal cooling efficiency
Solution Approach 1:
The cooling device is divided into two separate radiators (first radiator and second radiator) instead of using a single radiator. Each radiator has its own top tank and bottom tank, creating segmented cooling zones that collectively provide larger surface area for heat dissipation while maintaining manageable device complexity through modular design
Solution Approach 2:
The two radiators are positioned at different angles relative to the bottom panel of the server system. The first radiator is positioned at a first angle and the second radiator at a second angle, utilizing spatial dimensionality to maximize surface area exposure for heat dissipation without simply increasing the footprint in a single plane
2Productivity
If the radiators are positioned parallel to the bottom panel, then the device structure is simplified, but the heat dissipation efficiency is reduced
Solution Approach 1:
The radiators are positioned at asymmetric angles relative to the bottom panel rather than being parallel. The first radiator is angled at a first angle and the second radiator at a second angle, creating an asymmetric configuration that optimizes heat dissipation efficiency by improving airflow patterns and thermal convection while adding structural complexity
3Power
If cooling surface area is increased with dual radiators, then heat dissipation rate improves to 8.5-20 kW, but the device occupies more space
Solution Approach 1:
Instead of simply placing two radiators side-by-side in the same plane (increasing footprint), the radiators are positioned at different angles relative to the bottom panel. This angular positioning utilizes three-dimensional space more effectively, allowing the radiators to be stacked or arranged in a compact configuration that achieves high heat dissipation rate (8.5-20 kW) while minimizing the device footprint
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dual-radiator configuration improves cooling efficiency by increasing the surface area for heat dissipation, allowing for a heat dissipation rate of 8.5-20 kW, which is more effective than single-radiator systems, and effectively recirculates cooled liquid coolant to maintain optimal component temperatures.
Implementation Method 1
Another way to assist in the transfer of heat from an area of higher temperature to an area of lower temperature is by adding components that promote thermal conduction or convection
Implementation Method 2
The cooling device also includes a fan directing airflow through the first radiator and the second radiator
Implementation Method 3
The cooling device also includes a pump fluidly coupled to the outlet conduit
Data Source
AI summary
A cooling device for a computing system is disclosed. The cooling device includes an inlet conduit, a first radiator, a second radiator, a connecting conduit, and an outlet conduit. The first radiator has a first top tank and a first bottom tank. The first top tank is coupled to the inlet conduit. The second radiator has a second top tank and a second bottom tank. The second radiator is positioned parallel to the first radiator. The first radiator and the second radiator are positioned at an angle relative to a bottom panel of the computing system. The connecting conduit has a first end coupled to the first bottom tank and a second end coupled to the second bottom tank. The outlet conduit is coupled to the second top tank.