Dual-Recess Encapsulation Cap with Single Getter for Display Devices
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Solution Overview
Problem
Conventional organic electroluminescence devices require two separate metal caps to seal structural elements, increasing the size and thickness of devices like cellular phones, while also needing multiple getters for moisture absorption, which complicates the process and increases material usage.
Innovation Solution
An encapsulation cap with recesses on both surfaces of a single cap that connects two substrates through penetrating holes, allowing a single getter to absorb moisture from both sides, reducing the overall size and simplifying the attachment process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If two separate metal caps are used to seal structural elements on both substrates, then each substrate is adequately protected, but the device thickness and size increase
Solution Approach 1:
The patent combines two separate encapsulation caps into a single integrated cap structure that simultaneously encapsulates both substrates. The cap features first and second recesses on opposite surfaces, each accommodating structural elements from respective substrates, thereby reducing device thickness while maintaining sealing protection through unified encapsulation.
Solution Approach 2:
The invention transitions from a single-sided encapsulation approach to a dual-sided encapsulation structure. By forming recesses on both the first and second surfaces of the cap, the structure effectively utilizes three-dimensional space to protect structural elements on both substrates without increasing overall device thickness.
2Reliability
If multiple getters are attached to both caps, then moisture absorption is sufficient, but the manufacturing process and material usage become more complex
Solution Approach 1:
The patent consolidates moisture absorption functionality into a single getter attached to the integrated cap structure. This single getter serves both recesses simultaneously, eliminating the need for separate getters on each cap, thereby simplifying the manufacturing process and reducing material usage while maintaining adequate moisture absorption for both substrates.
3Reliability
If two separate caps are used, then each substrate is independently sealed, but the attachment process becomes more complicated
Solution Approach 1:
The invention simplifies the attachment process by integrating two encapsulation functions into a single cap component. This unified cap with dual recesses is attached in one operation, eliminating the need for separate attachment steps for two individual caps, thereby reducing process complexity while maintaining effective sealing for both substrates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The encapsulation cap effectively seals structural elements on both substrates with a single getter, minimizing device thickness and simplifying the attachment process, while maintaining moisture absorption functionality.
Implementation Method 1
a getter is attached onto the bottom surface of one recess to absorb moisture from both recesses
Data Source
AI summary
The present invention discloses an encapsulation cap which not only seals simultaneously structural elements formed on two substrates but also has sufficient moisture-absorbing function by using only one getter (moisture absorbent) attached thereto, and a display device using the same. For separating structural elements formed on the glass substrate from the exterior, an encapsulation cap according to the present invention comprises a first surface on which a first recess is formed; and a second surface which is opposite to the first surface and has a second recess formed thereon, wherein the first surface is attached to a first substrate on which structural elements are formed, the second surface is attached to a second substrate on which structural elements are formed, and the structural elements formed on the first and second substrates are received in the first and second recess, respectively.