Dual-Reflector LED Optical System for Chip-on-Board Heat and Light Management

The patent merges multiple LED chips onto a single substrate to create a chip-on-board LED package, consolidating what would traditionally require numerous discrete chips into one integrated unit. This reduces the total number of components needed in the luminaire while maintaining sufficient light output, thereby lowering manufacturing costs and improving efficiency

By integrating multiple LED chips onto a single substrate with integrated optics, the patent reduces the total component count. Instead of requiring individual optics for each discrete chip, the chip-on-board design consolidates optical elements, thereby simplifying the overall device structure while maintaining effective light distribution

The patent segments the optical system into multiple reflectors (upper and lower reflectors) with specific geometric configurations. This segmentation allows each reflector to be optimized for specific light redirection tasks, making the overall optical design manageable despite the non-point source nature of chip-on-board LEDs. The segmented approach enables effective light distribution while maintaining manufacturing cost advantages

By merging multiple LED chips onto a single substrate, the patent creates a consolidated heat generation point that can be more effectively managed through integrated thermal pathways. The substrate serves as a common thermal management platform, allowing for more efficient heat dissipation compared to numerous discrete chips scattered throughout the luminaire, thereby reducing thermal issues while maintaining optical design simplicity