Dual-Resin Dam Encapsulation for OLED Moisture Blocking
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Solution Overview
Problem
Organic light-emitting display devices are vulnerable to heat, moisture, and oxygen, leading to reliability and lifespan issues, and existing encapsulation technologies struggle to balance moisture penetration suppression with bonding force and bezel area reduction.
Innovation Solution
A display device design featuring a substrate with a display area and non-display area, utilizing a combination of dams made from epoxy-based and urethane-based resins to enhance moisture blocking and bonding force, while minimizing oxygen penetration and reducing bezel width through precise dam application and alignment key overlap during the scribing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If encapsulation technologies are used to inhibit moisture and oxygen penetration, then reliability and device lifespan are improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The encapsulation structure is divided into multiple functional layers: an inorganic encapsulation layer for moisture and oxygen barrier, an organic encapsulation layer for additional protection and flexibility, and a bonding layer for substrate attachment. This segmentation allows each layer to specialize in specific protective functions, improving overall reliability while enabling modular manufacturing processes.
Solution Approach 2:
The patent employs composite encapsulation structures combining inorganic materials (such as silicon oxide, silicon nitride) with organic materials (such as BCB, PMMA). This composite approach leverages the low permeability of inorganic materials to moisture and oxygen while utilizing the flexibility and bonding capabilities of organic materials, achieving superior protection without excessive structural complexity.
2Object-affected harmful factors
If thicker encapsulation layers are used to block moisture and oxygen, then penetration resistance improves, but device thickness and weight increase
Solution Approach 1:
The patent utilizes thin-film encapsulation techniques where multiple nanometer-to-micrometer scale layers provide effective barrier properties. The inorganic encapsulation layer is formed as a thin film with sufficient thickness to block moisture and oxygen penetration while maintaining overall device thinness and minimizing weight addition.
Solution Approach 2:
The patent optimizes the thickness parameters of each encapsulation layer to achieve the minimum required protection level. By precisely controlling layer thicknesses and combining materials with different permeability characteristics, the design achieves effective barrier properties without using excessive material thickness that would increase weight.
3Object-affected harmful factors
If multiple encapsulation layers are added to improve moisture blocking, then protection performance improves, but manufacturing precision requirements increase
Solution Approach 1:
The patent employs self-aligned fabrication processes where subsequent encapsulation layers are automatically positioned relative to previous layers through the same patterning and deposition tools. This self-alignment mechanism reduces the need for additional alignment steps and minimizes cumulative positioning errors, thereby lowering manufacturing precision requirements despite multiple layers.
Solution Approach 2:
The patent performs preliminary planarization and surface preparation steps before depositing each encapsulation layer to ensure optimal adhesion and uniform thickness. By preparing the substrate surface in advance and controlling deposition parameters beforehand, the process achieves consistent layer quality with reduced precision demands during actual layer formation.
Data Source
AI summary
Discussed is a display device including a substrate having a display area, and a non-display area adjacent to the display area, an encapsulation substrate disposed on the substrate, and a plurality of dams disposed between the substrate and the encapsulation substrate. The plurality of dams includes a first dam disposed in the non-display area and including an epoxy-based resin, and a second dam disposed outside the first dam and including a urethane-based resin. The first dam and the second dam minimize a penetration of outside moisture and oxygen into the display device in a state in which a bonding force is increased.