Dual-Resin Semiconductor Package for Lead Terminal Separation
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Solution Overview
Problem
The existing semiconductor device structure, as described in Patent Literature 1, faces challenges in enhancing productivity due to the need for etching the lead frame to separate lead terminals before resin sealing, which complicates the manufacturing process and increases the risk of damage to bonding wires.
Innovation Solution
The semiconductor device incorporates a design where the first and second lead terminals are sealed with a first resin, and the semiconductor elements are sealed with a second resin, while a connecting conductor formed from a lead frame, thinner than the lead terminals, electrically connects the semiconductor elements, thereby simplifying the manufacturing process and enhancing productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the lead frame is etched to separate lead terminals before resin sealing, then the lead terminals can be separated from each other, but the manufacturing process becomes complex and productivity decreases
Solution Approach 1:
The patent divides the sealing process into two independent stages: first sealing the lead terminals with a first resin, then sealing the semiconductor elements with a second resin. This segmentation eliminates the need for etching the lead frame to separate terminals, as they are already separated by the first resin encapsulation, thus improving productivity while maintaining manufacturing precision.
Solution Approach 2:
The patent performs the lead terminal separation action in advance by sealing them with the first resin before mounting the semiconductor elements. This preliminary encapsulation separates the lead terminals without requiring etching of the lead frame, simplifying the subsequent manufacturing steps and enhancing overall productivity.
2Manufacturing precision
If the lead frame is etched to separate lead terminals, then the lead terminals can be individually positioned, but the risk of damage to bonding wires increases
Solution Approach 1:
The patent applies beforehand cushioning by sealing the lead terminals with the first resin before any subsequent manufacturing steps. This resin encapsulation acts as a protective cushion that prevents damage to bonding wires during lead terminal separation and positioning operations, eliminating the risk associated with etching the lead frame after bonding wires are attached.
Solution Approach 2:
The patent performs the lead terminal separation and positioning action in advance by sealing them with the first resin before mounting semiconductor elements and forming bonding wires. This preliminary encapsulation ensures lead terminals are properly positioned and protected before any operations that could damage bonding wires, thereby maintaining reliability.
3Device complexity
If all components are sealed with resin in a lump, then the structure is simplified, but the lead terminals cannot be easily coupled with semiconductor elements
Solution Approach 1:
The patent segments the sealing process into two distinct resin encapsulation stages: first sealing the lead terminals with a first resin, then sealing the semiconductor elements with a second resin. This segmentation maintains structural simplicity while enabling easy coupling, as the first resin-encapsulated lead terminals provide accessible coupling surfaces for mounting semiconductor elements before the second resin is applied.
Solution Approach 2:
The patent performs the lead terminal encapsulation with the first resin as a preliminary action before mounting semiconductor elements. This preliminary encapsulation creates well-defined coupling interfaces that facilitate easy and reliable attachment of semiconductor elements, avoiding the difficulties of coupling within a single-lump resin structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for enhanced productivity by simplifying the manufacturing process, reducing the risk of damage during etching, and enabling easier coupling of lead terminals with semiconductor elements, ultimately leading to higher efficiency and reliability in semiconductor device production.
Implementation Method 1
a first resin with which the first lead terminal and the second lead terminal are sealed
Implementation Method 2
a second resin with which the at least one first semiconductor element and the second semiconductor element are sealed
Implementation Method 3
The at least one first semiconductor element has a third electrode. The second semiconductor element has a fourth electrode. The third electrode of the at least one first semiconductor element and the fourth electrode of the second semiconductor element are each connected to the connecting conductor
Data Source
AI summary
A semiconductor device includes at least one first semiconductor element having a first electrode, a second semiconductor element having a second electrode, a first lead terminal connected to the first electrode of the at least one first semiconductor element, a second lead terminal connected to the second electrode of the second semiconductor element, a first resin with which the first lead terminal and the second lead terminal are sealed, and a second resin with which the at least one first semiconductor element and the second semiconductor element are sealed.