Dual-Resolution Photolithography for Flat Panel Displays

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Solution Overview

Problem

The existing photolithography processes for fabricating flat panel displays are inefficient and costly due to the need for multiple high-precision exposure machines to define both large and small patterns, which increases processing time and requires expensive equipment.

Innovation Solution

A method utilizing two exposure machines with different resolutions to expose a photoresist layer, where a lower-resolution machine defines larger patterns and a higher-resolution machine defines smaller patterns, reducing overall processing time and the need for expensive high-precision machines.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If multiple high-precision exposure machines are used to define both large and small patterns, then manufacturing precision is improved, but processing time increases and equipment cost increases

Engineering Contradiction:
Improvepattern definition precisionVSAvoidprocessing time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The exposure process is segmented into two distinct stages: a first exposure process for forming large patterns (such as pixel electrodes and common electrodes) and a second exposure process for forming small patterns (such as transistor electrodes and data lines). This segmentation allows each exposure process to be optimized for its specific pattern size requirements, improving overall efficiency while maintaining precision for both large and small features

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent employs dynamic selection of exposure machines based on pattern size requirements. Different exposure machines with different resolutions are used at different stages of the manufacturing process, allowing the system to adapt its capabilities to match the specific requirements of each pattern formation task, thereby optimizing both precision and processing time

Inventive Principle:
Principle #15Dynamics

2Manufacturing precision

If multiple high-precision exposure machines are used to define both large and small patterns, then manufacturing precision is improved, but equipment cost increases

Engineering Contradiction:
Improvepattern definition precisionVSAvoidnumber of exposure machines
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The exposure process is segmented into two distinct stages: a first exposure process for forming large patterns (such as pixel electrodes and common electrodes) and a second exposure process for forming small patterns (such as transistor electrodes and data lines). This segmentation allows each exposure process to be optimized for its specific pattern size requirements, improving overall efficiency while maintaining precision for both large and small features

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different exposure machines with different resolution characteristics are assigned to different pattern formation tasks based on local requirements. Low-resolution machines handle large patterns where high precision is less critical, while high-resolution machines handle small patterns requiring fine detail, optimizing the overall system configuration and reducing the need for multiple high-precision machines

Inventive Principle:
Principle #3Local quality

3Manufacturing precision

If a single high-precision exposure machine is used for all patterns, then manufacturing precision is maintained, but productivity decreases

Engineering Contradiction:
Improvepattern definition precisionVSAvoidexposure processing efficiency
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The exposure process is segmented into two distinct stages: a first exposure process for forming large patterns (such as pixel electrodes and common electrodes) and a second exposure process for forming small patterns (such as transistor electrodes and data lines). This segmentation allows each exposure process to be optimized for its specific pattern size requirements, improving overall efficiency while maintaining precision for both large and small features

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent changes the resolution parameter of the exposure process by using different exposure machines with different resolution capabilities for different pattern formation tasks. This parameter change allows the system to match the exposure resolution to the pattern size requirements, improving productivity by using lower-resolution (faster) machines for large patterns and higher-resolution (slower) machines only when necessary for small patterns

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces the total time required for exposing photoresist layers and decreases the number of high-precision exposure machines needed, thereby lowering costs and improving efficiency in fabricating flat panel displays.

Implementation Method 1

exposing a photo-resist layer using a first exposure machine that has a first resolution to cause the photo-resist layer to have an exposed portion and an un-exposed portion

Methodology Applied
Scientific EffectPhotopolymerisation: Photopolymerisation

Implementation Method 2

exposing the photo-resist layer using a second exposure machine that has a second resolution to further expose the unexposed portion of the photo-resist layer

Methodology Applied
Scientific EffectPhotopolymerisation: Photopolymerisation

Data Source

PatentUS7851141B2Flat panel display manufacturing
Publication Date: 2010.12.14 RED OAK INNOVATIONS LTD
  • US7851141B2 patent drawing
  • US7851141B2 patent drawing
  • US7851141B2 patent drawing

AI summary

A method includes exposing a photo-resist layer using a first exposure machine that has a first resolution to cause the photo-resist layer to have an exposed portion and an un-exposed portion. The photo-resist layer is exposed using a second exposure machine that has a second resolution to further expose the un-exposed portion of the photo-resist layer, the first resolution being different from the second resolution.