Dual-Ring Bevel CMP Polishing Module for Longer Pad Life
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Solution Overview
Problem
Conventional bevel CMP technology for semiconductor substrates requires frequent replacement of polishing tapes and has a complex equipment structure, leading to inefficiencies in productivity.
Innovation Solution
A substrate polishing module with ring-shaped platens and polishing pads on upper and lower portions of the substrate, along with a driver to rotate the platens, simplifies the equipment structure and extends the replacement cycle of consumable polishing pads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional polishing tapes are used for bevel CMP, then the bevel portion can be polished, but the polishing tapes need frequent replacement and the equipment structure becomes complicated
Solution Approach 1:
The polishing system is segmented into an upper polishing unit and a lower polishing unit, each with independent polishing pads mounted on separate platens. This segmentation allows each unit to operate independently, simplifying the overall structure while maintaining effective bevel polishing capability through coordinated action of both units
Solution Approach 2:
Instead of using a single polishing tape from one side, the invention applies polishing pads from both the upper and lower sides of the substrate simultaneously. This inverted approach of dual-sided polishing eliminates the need for frequent tape replacement and simplifies the equipment structure by distributing the polishing function across two simpler units
2Reliability
If conventional polishing tapes are used for bevel CMP, then the bevel portion can be polished, but the replacement cycle is short and productivity decreases
Solution Approach 1:
The polishing function is divided into upper and lower segments that can operate simultaneously. This segmentation allows the polishing process to continue without interruption from tape replacement, as the dual-sided approach distributes wear and extends the effective operational cycle before maintenance is needed
Solution Approach 2:
The dual-sided polishing configuration enables continuous useful action by allowing both upper and lower polishing pads to work simultaneously on the substrate. This continuity eliminates downtime associated with frequent tape replacement, thereby extending the replacement cycle and improving productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances productivity by simplifying the bevel CMP equipment structure and increasing the replacement cycle of polishing pads, improving overall efficiency.
Implementation Method 1
a polishing pad on each platen of the pair of platens such that the polishing pad is configured to be in contact with a corresponding one of an upper and lower surface of the substrate and to polish a bevel of the substrate
Data Source
AI summary
A substrate polishing module according to at least one embodiment includes a pair of ring-shaped platens disposed along the circumference of the substrate, respectively on the upper and lower portions of the substrate, a polishing pad disposed on each platen of the pair of platens and in contact with the upper and lower surfaces of the substrate to polish a bevel of the substrate, and a driver that rotates each of the platens.