Dual-Robot Transfer Vacuum Chamber for High-Throughput Wafer Handling
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Solution Overview
Problem
Conventional Ultra High Vacuum (UHV) substrate processing systems have limited throughput due to sequential process handling and large footprints, primarily constrained by the number of process modules and transfer chamber width, which restricts productivity and efficiency.
Innovation Solution
A substrate processing system with a single transfer vacuum chamber equipped with two 'five axis' transfer robots and multiple load lock chambers, allowing for efficient substrate transfer and processing without additional transfer chambers, while maintaining a compact footprint by optimizing the placement and accessibility of substrate modules and load lock chambers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a single transfer vacuum chamber with bi-symmetric robot is used, then the system footprint is reduced, but the throughput is limited to up to 6 process modules
Solution Approach 1:
The system divides the transfer chamber into two distinct transfer regions (first and second transfer regions) that operate in parallel, allowing simultaneous substrate transfers to different process modules. This segmentation enables the system to accommodate more process modules (up to 12) while maintaining a compact footprint, as each region can independently handle substrate transfers without interfering with the other.
Solution Approach 2:
The patent introduces a vertical dimension to the transfer system by implementing multiple load lock chambers (first and second load lock chambers) that can operate simultaneously. This multi-level arrangement allows substrates to be processed in parallel through different vertical paths, increasing throughput without significantly expanding the horizontal footprint of the system.
2Productivity
If two transfer chambers with bi-symmetric robots are used, then the throughput increases to up to 9 process modules, but the system footprint increases
Solution Approach 1:
The patent merges the functions of two separate transfer chambers into a single integrated transfer vacuum chamber that contains two independent transfer regions. This consolidation allows the system to achieve the throughput capability of dual-chamber systems (handling up to 12 process modules) while reducing the overall footprint by eliminating redundant chamber structures, vacuum seals, and support infrastructure.
Solution Approach 2:
The single transfer vacuum chamber is designed to perform multiple functions simultaneously by incorporating two independent transfer regions that can operate in parallel. Each region can independently transfer substrates to different process modules, making the single chamber as effective as two separate chambers would be, thereby increasing throughput without the penalty of doubled footprint.
3Device complexity
If sequential process handling is used, then the system complexity is reduced, but the productivity is limited by handling time
Solution Approach 1:
The system implements preliminary action by pre-positioning substrates in multiple load lock chambers before they are needed by the process modules. The first and second load lock chambers can independently prepare substrates for transfer, eliminating waiting time and ensuring that substrates are ready for immediate processing. This preliminary preparation significantly reduces handling time and increases productivity without adding complex real-time coordination mechanisms.
Solution Approach 2:
The patent achieves continuity of useful action by implementing parallel transfer regions that can operate simultaneously and continuously. While one transfer region is moving a substrate to a process module, the other region can simultaneously transfer another substrate to a different module. This continuous parallel operation eliminates idle time and maintains constant productivity, effectively doubling the throughput compared to sequential handling without requiring complex synchronization.
Data Source
AI summary
A transfer vacuum chamber for handling a substrate under vacuum conditions is in communication with at least two substrate modules connected to the transfer vacuum chamber by a respective connection slot. The at least two substrate modules can receive at least one substrate. At least one of the at least two substrate modules is a substrate processing module. At least two load lock chambers are in vacuum communication with the transfer vacuum chamber. The transfer vacuum chamber includes at least two transfer robots disposed within the transfer vacuum chamber configured to transfer a substrate between the at least two load lock chambers and the at least one substrate processing module under vacuum conditions.