Dual-Robot Wafer Handling Layout for Throughput Bottlenecks
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Solution Overview
Problem
Traditional transport systems in semiconductor processing limit the throughput of workpieces from load locks to orientation stations and platen, resulting in bottlenecks that hinder higher processing rates.
Innovation Solution
A system comprising two load locks, two robots with independently retracting and extending arms, and an orientation station, where each robot follows a fixed sequence to transfer workpieces between load locks, orientation stations, and platen, optimizing the workflow to increase throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional transport systems are used to transfer workpieces from load lock to platen, then the system structure is simple, but the throughput is limited to roughly 500 workpieces per hour
Solution Approach 1:
The transport system is segmented into multiple independent robots (at least two robots), each capable of performing the complete sequence of operations independently. This segmentation allows parallel processing where multiple workpieces can be handled simultaneously by different robots, thereby increasing throughput from 500 to over 900 workpieces per hour while maintaining manageable complexity through modular design
Solution Approach 2:
The system introduces temporal dimensionality through coordinated scheduling of multiple robots operating in parallel sequences. By staggers the execution timing of identical operation sequences across multiple robots, the system achieves higher throughput without proportionally increasing physical space requirements, transforming a single-dimensional sequential process into a multi-dimensional parallel system
2Productivity
If processing speed on platen is increased to 5 seconds per workpiece, then processing capacity reaches 720 workpieces per hour, but transport system becomes the bottleneck limiting actual throughput
Solution Approach 1:
The system performs preliminary actions by having robots prepare and position workpieces at the orientation station before they are needed on the platen. The orientation station pre-aligns workpieces in advance, so when the platen is ready for the next workpiece, it is already prepared and waiting, eliminating waiting time and ensuring transport does not bottleneck the high-speed processing
Solution Approach 2:
The system maintains continuous useful action by ensuring that while one robot is transporting a workpiece to the platen, another robot is simultaneously preparing the next workpiece at the orientation station. This continuous pipeline operation eliminates idle time in the transport sequence, allowing the system to sustain the high processing rate of 5 seconds per workpiece without transport interruptions
Data Source
AI summary
A system for transferring semiconductor workpieces from a load lock to an orientation station and on to a platen is disclosed. The system comprises two load locks, two robots, and one orientation station. Each robot is associated with a respective load lock and follows a fixed sequence. The robot returns a processed workpiece to the load lock and also removes an unprocessed workpiece. The robot then moved to the orientation station, where it removes an aligned workpiece from the orientation station and deposits the unprocessed workpiece on the orientation station. Next, the robot moves to the platen, where it removes a processed workpiece and deposits the aligned workpiece. The robot then returns to the load lock and repeats this sequence.