Dual Robotic Arm Chip Bonding Apparatus for Parallel Processing
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Solution Overview
Problem
Existing chip bonding techniques are unsuitable for mass production due to limitations in bonding accuracy and yield, requiring sequential bonding of each chip which is inefficient.
Innovation Solution
A chip bonding apparatus comprising a chip separation unit, alignment unit, bonding unit, and dual robotic arm system that allows simultaneous delivery, alignment, and bonding of chips, enabling continuous processing and increased efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If sequential one-by-one chip bonding is used, then bonding accuracy can be maintained, but production efficiency deteriorates
Solution Approach 1:
The bonding apparatus is segmented into multiple independent robotic arm units (first bonding robotic arm unit with first motion stage, second bonding robotic arm unit with second motion stage). Each unit can independently perform chip picking, alignment, and bonding operations on different chips simultaneously, transforming a single sequential process into multiple parallel processes that maintain precision while improving throughput
Solution Approach 2:
The patent implements continuous streaming processing where chips flow continuously through the bonding apparatus. Multiple robotic arms operate in continuous cycles, with each arm picking chips from the separation unit, delivering to alignment unit, and bonding at the bonding unit without interruption. This continuous action eliminates idle time between operations and maintains high productivity while preserving bonding accuracy through consistent process control
2Device complexity
If sequential chip processing is used, then process control is simplified, but time consumption increases
Solution Approach 1:
The processing workflow is segmented into distinct functional units (separation unit, alignment unit, bonding unit) with dedicated robotic arms for each operation. This segmentation allows simultaneous execution of multiple operations across different units while maintaining simplified control within each unit, reducing overall process cycle time without excessive complexity
Solution Approach 2:
Chips undergo preliminary alignment and positioning in the alignment unit before bonding. The alignment unit prepares chips in advance by positioning them correctly, so when chips reach the bonding unit, they are ready for immediate bonding. This preliminary action eliminates waiting time during bonding operations and reduces total process cycle time
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves time savings and higher production efficiency by enabling simultaneous chip delivery, alignment, and bonding, while also supporting both chip-up and chip-down modes for expanded applicability.
Implementation Method 1
a first bonding robotic arm which is arranged on the first motion stage and configured to suck up a chip from the chip separation unit and deliver it to the chip alignment unit
Data Source
AI summary
A chip bonding apparatus includes a chip separation unit, a chip alignment unit, a chip bonding unit and a bonding robotic arm unit. The bonding robotic arm unit includes a first bonding robotic arm unit and a second bonding robotic arm unit. The first bonding robotic arm unit includes a first motion stage, a first driver configured to drive the first motion stage and at least one first bonding robotic arm arranged on the first motion stage. The first bonding robotic arm is configured to suck up a chip from the chip separation unit and deliver it to the chip alignment unit. The second bonding robotic arm unit includes a second motion stage, a second driver configured to drive the second motion stage and at least one second bonding robotic arm arranged on the second motion stage.