Dual-Rotation Substrate Holder for Uniform Multi-Substrate Sputtering
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Solution Overview
Problem
Existing sputtering processes struggle to achieve uniform and high-quality thin-film deposition on multiple substrates simultaneously.
Innovation Solution
A sputtering apparatus with a substrate holder assembly that rotates about a holder axis while each substrate rotates individually about a non-parallel substrate axis, allowing simultaneous dual-rotation for even coating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple substrates are processed simultaneously to increase productivity, then the output per unit time improves, but the uniformity of film deposition deteriorates
Solution Approach 1:
The system divides the substrate processing into multiple independent rotation axes: a holder axis for supporting multiple substrates and individual substrate axes for each substrate. This segmentation allows each substrate to be independently rotated to ensure uniform coating while maintaining high productivity through simultaneous processing of multiple substrates.
Solution Approach 2:
The system introduces dynamic rotation capabilities where each substrate can rotate about its own axis while the holder rotates about a common axis. This dynamic multi-axis rotation system enables uniform film deposition on multiple substrates simultaneously by continuously changing the orientation of each substrate relative to the sputtering source.
2Ease of manufacture
If a simple holder system is used to reduce device complexity, then the ease of manufacture improves, but the ability to achieve uniform deposition on multiple substrates deteriorates
Solution Approach 1:
The system implements a dynamic rotation mechanism where substrates can rotate about individual axes while being held on a rotating holder. This dynamic configuration, using straightforward rotational mechanics rather than complex positioning systems, achieves uniform deposition while remaining relatively simple to manufacture and operate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables smooth and uniform deposition of sputtered material onto multiple substrates, ensuring high-quality thin-film formation.
Implementation Method 1
The sputtered material is configured to be deposited onto the plurality of elongated substrates
Implementation Method 2
The manufacturing process of sputtering is a widely used process across many industries
Data Source
AI summary
A sputtering apparatus includes a substrate holder assembly configured to support a plurality of elongated substrates relative to a sputtering source. Each elongated substrate of the plurality of elongated substrates extends along a respective substrate axis. The sputtering apparatus also includes a holder drive assembly that is configured to rotate the substrate holder assembly about a holder axis. Each respective substrate axis is oriented non-parallel relative to the holder axis. Further, the sputtering apparatus includes a substrate drive assembly that is configured to individually rotate each elongated substrate about its respective substrate axis. The sputtered material is configured to be deposited onto the plurality of elongated substrates as the substrate holder assembly is being rotated about the holder rotational axis simultaneous with the rotation of each elongated substrate about its respective substrate axis.