Dual Scan Robot Ion Implant Layout for Continuous Wafer Scanning
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Solution Overview
Problem
Conventional single ion scan robots in ion implant systems are unable to perform scanning during wafer transportation, leading to reduced wafer processing efficiency and wastage of costly ion beams.
Innovation Solution
A dual scan-type ion implant system is introduced, featuring two scan robots inside the process chamber that receive wafers from an EFEM along non-overlapping paths and alternately perform ion beam scanning, allowing continuous scanning without interruption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single ion scan robot is used to handle both wafer transportation and scanning, then device complexity is reduced, but productivity decreases due to inability to perform scanning during transportation
Solution Approach 1:
The system divides the single scan robot function into two separate scan robots, allowing one to handle transportation while the other performs scanning operations simultaneously. This segmentation enables parallel execution of tasks that were previously sequential, resolving the contradiction between device simplicity and productivity.
Solution Approach 2:
By introducing a second scan robot, the system ensures continuous useful action during wafer transportation. While one robot transports wafers, the other maintains uninterrupted scanning operations, eliminating idle time and maximizing productivity without significantly increasing overall system complexity.
2Ease of operation
If a single ion scan robot performs all tasks sequentially, then ease of operation is improved, but loss of time increases due to idle scanning periods
Solution Approach 1:
The operational responsibilities are segmented between two scan robots: one dedicated to wafer transportation and the other to scanning. This division allows both functions to operate simultaneously without interference, eliminating the time loss that occurs when a single robot must switch between tasks.
Solution Approach 2:
The system performs preliminary positioning and preparation actions through coordinated operation of both robots. While one robot prepares the next wafer for transportation, the other robot is already positioned and ready to continue scanning, ensuring no idle time is lost during transitions.
3Reliability
If scanning stops during wafer transportation, then reliability of scanning process is maintained, but productivity decreases due to wasted ion beams
Solution Approach 1:
The system segments the scanning function from the transportation function by using separate robots for each task. This allows the scanning robot to maintain stable, uninterrupted scanning operations while the transportation robot handles wafer movement independently, preventing the need to stop scanning for reliability reasons.
Solution Approach 2:
The dual robot configuration enables continuous useful action by maintaining uninterrupted scanning operations during wafer transportation. The scanning robot operates continuously without stopping, eliminating waste of ion beams and maximizing productivity while maintaining process reliability through dedicated functional separation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dual scan-type system significantly enhances wafer processing efficiency by enabling continuous ion beam scanning during wafer transportation, reducing wastage of ion beams and improving throughput.
Implementation Method 1
the ion injection process refers to injecting charged impurities into a wafer at predetermined energy, in a desired quantity, and to a desired depth
Data Source
AI summary
Proposed is a dual scan-type ion implant system including a process chamber, first and second scan robots, and an EFEM. In the process chamber, scanning is performed with an ion beam. The first and second scan robots are placed inside the process chamber. The EFEM is provided on one side of the process chamber, and is equipped with a plurality of wafer cassettes. The first and second scan robots inside the process chamber receive wafers from the EFEM along different non-overlapping wafer scan transfer paths, respectively, and then the first and second scan robots alternately perform ion beam scanning.