Dual-Scan Thickness Profiling for Food Product Void Detection
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Solution Overview
Problem
Existing portioning machines for food products fail to accurately detect undercuts and voids, leading to erroneous cutting and portioning, as they rely on scanning techniques that assume a flat surface and cannot 'see through' or detect internal anomalies.
Innovation Solution
A method and system that combines X-ray and optical scanning to determine the thickness profile of food products, comparing data sets to identify and map voids and undercuts, allowing for precise trimming and cutting based on actual product dimensions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If optical scanning is used to determine thickness profile, then the scanning speed and productivity are improved, but the measurement precision deteriorates due to inability to detect undercuts and voids
Solution Approach 1:
The patent combines two different scanning techniques (optical scanning and X-ray scanning) into a unified system. The optical scanner provides high-speed surface thickness profile data, while the X-ray scanner penetrates the work product to detect internal voids and undercuts. By merging these complementary scanning methods and integrating their data through coordinate transformation and comparison, the system achieves both high productivity and accurate measurement precision that neither scanner could achieve alone.
2Measurement precision
If X-ray scanning is used to detect internal anomalies, then the measurement precision is improved, but the device complexity increases
Solution Approach 1:
The patent integrates optical scanning and X-ray scanning systems into a coordinated dual-scanning apparatus. The optical scanner and X-ray scanner are positioned to scan the same work product simultaneously or sequentially, with their coordinate systems transformed and aligned through mathematical relationships. This merging allows the system to detect both surface geometry and internal anomalies, achieving comprehensive measurement precision despite the increased device complexity of incorporating two scanning technologies.
3Ease of operation
If traditional scanning assuming flat surface is used, then the ease of operation is maintained, but the reliability of portioning deteriorates due to undetected undercuts
Solution Approach 1:
The patent performs preliminary detection of undercuts and voids using X-ray scanning before the final portioning decision is made. The system first obtains surface thickness profile data from optical scanning, then uses X-ray scanning to identify internal anomalies that would affect portioning accuracy. By performing this preliminary anomaly detection and integrating it with surface data, the system maintains operational simplicity while significantly improving portioning reliability, as the cutting system receives corrected thickness information that accounts for hidden defects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate detection and processing of food products with undercuts and voids, ensuring uniform portions and reducing errors in cutting and portioning by accounting for internal anomalies.
Implementation Method 1
In X-ray scanning, X-rays are passed through the work product, with the level of attenuation of the work product being related to mass of the work product
Implementation Method 2
An optical scanning system may utilize a CCD camera or video camera to view a work product illuminated by one or more light sources
Data Source
Figure 1
Figure 2~3
Figure 4a~4c
AI summary
A processing system (10) and a corresponding method are provided for processing work products (WP), including food items, to locate and quantify voids, undercuts and similar anomalies in the work products. The work products are conveyed past an X-ray scanner (14) by a conveyance device (12). Data from the X-ray scanning is transmitted to control system (18). Simultaneously with the X-ray scanning of the work product, the work product is optically scanned at the same location on the work product where X-ray scanning is occurring. The data from the optical scanner is also transmitted to the control system. Such data is analyzed to develop or generate the thickness profile of the work product. From the differences in the thickness profiles generated from the X-ray scanning data versus the optical scanning data, the location of voids, undercuts and similar anomalies can be determined by the control system. This information is used by the processing system (10) to process the work product as desired, including adjusting for the locations and sizes of voids, undercuts and similar anomalies present in the work product.