Dual-Seal Cooling Socket for Electronic Component Leak Containment

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Solution Overview

Problem

Direct fluid cooling of electronic components poses a challenge due to the risk of coolant leakage, which can cause costly damage and failures, especially since existing single-seal solutions lack redundancy and are prone to failure.

Innovation Solution

A dual-seal assembly is implemented, where a first seal encloses the electronic component and a second seal surrounds the first seal, with the second seal pressurized with a gas to maintain fluid containment and detect potential failures by monitoring pressure differentials.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single seal is used to contain cooling fluid, then the device complexity is reduced, but the reliability of fluid containment deteriorates due to lack of redundancy

Engineering Contradiction:

Improveseal assembly structureVSAvoidfluid containment

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The seal assembly is divided into multiple independent seal elements (first seal and second seal) that work together to contain the cooling fluid. Each seal provides a separate barrier, so that if one seal fails, the other can still maintain containment, thus improving reliability without requiring a completely different approach

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent implements a redundant seal system where a second seal is positioned around the first seal to provide backup containment. This redundant structure acts as a pre-established safety measure that compensates for potential seal failures, ensuring continued fluid containment even when one seal deteriorates or fails

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

2Temperature

If direct fluid cooling is implemented to improve heat dissipation, then the cooling efficiency is improved, but the risk of coolant leakage and damage increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidcoolant leakage damage

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The patent incorporates pressure sensors that monitor the sealing environment. When a seal failure is detected through pressure changes, the system can trigger alerts or shutdown procedures that prevent catastrophic damage from coolant leakage. The potential harm of leakage is converted into a detectable signal that enables preventive action

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Reliability

If pressure monitoring is added to detect seal failures, then the reliability of failure detection is improved, but the device complexity increases

Engineering Contradiction:

Improvefailure detectionVSAvoidpressure monitoring system

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

Pressure sensors are positioned within the sealed environment to continuously monitor pressure conditions. When a seal failure occurs, the pressure change is detected and fed back to the control system, which can then trigger appropriate responses such as alerts or shutdown procedures. This feedback mechanism provides reliable failure detection through a relatively simple implementation

Inventive Principle:

Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The dual-seal assembly effectively reduces coolant leakage, maintains device operability, and provides a redundant safety measure to prevent catastrophic failures by using pressure differentials to detect and respond to seal failures.

Implementation Method 1

heat dissipation/transfer through a fluid interfacing with the electronic component

Methodology Applied

Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 2

the second seal pressurized with a gas to maintain fluid containment and detect potential failures by monitoring pressure differentials

Methodology Applied

Scientific EffectPressure differential: Pressure Gradient

Data Source

PatentUS20240328512A1Methods and apparatus to reduce leakage of cooling fluid used to cool an electronic component

Publication Date: 2024.10.03 INTEL CORP

AI summary

Methods, apparatus, systems, and articles of manufacture are disclosed that reduce leakage of a cooling fluid used to cool an electronic component. An example disclosed herein includes a seal assembly comprising a socket to receive an electronic component, the electronic component including a semiconductor die and a substrate to support the die, a first seal to be forced against the electronic component, the first seal to surround the die, and a second seal to be forced against the electronic component, the second seal to surround the first seal.