Dual Sealing Resin Strategy for Electronic Modules
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Solution Overview
Problem
Electronic modules with semiconductor devices and components having narrow electrode pitches face issues with sealing resins, where high liquidity resins can crush hollow components, and low liquidity resins may leave gaps between electrodes, leading to solder flashes or insufficient filling.
Innovation Solution
The use of two distinct sealing resins with different filler volume percentages and particle diameters, where a high-filler, low-liquidity resin with high humidity resistance seals components with hollow portions, and a low-filler, high-liquidity resin fills spaces between electrodes with narrow pitches, preventing gaps and crushing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a sealing resin with high liquidity is used to seal semiconductor devices with narrow electrode pitches, then the resin can sufficiently fill the spaces between electrodes and prevent gaps, but the resin may crush hollow portions of electronic components due to excessive pressure
Solution Approach 1:
The patent divides the sealing resin into two distinct types with different properties: a first sealing resin with high liquidity (low filler content) for filling narrow spaces between electrodes, and a second sealing resin with low liquidity (high filler content) for sealing hollow portions. This segmentation allows each resin to be optimized for its specific function, resolving the contradiction between filling completeness and preventing crushing.
Solution Approach 2:
The patent applies different resin properties to different locations and components: high-liquidity resin is used where narrow electrode pitches require excellent filling, while low-liquidity resin is used where hollow portions require gentle sealing. This local differentiation of material properties resolves the contradiction by matching resin characteristics to specific sealing requirements.
2Strength
If a sealing resin with low liquidity is used to seal electronic components with hollow portions, then the hollow portions are protected from crushing, but gaps may form between electrodes with narrow pitches due to insufficient filling
Solution Approach 1:
The patent segments the sealing resin into two types with complementary properties, allowing the low-liquidity resin to protect hollow portions while the high-liquidity resin ensures complete filling of narrow electrode spaces. This segmentation resolves the contradiction by distributing different functional requirements to different resin types.
Solution Approach 2:
The patent applies low-liquidity resin locally to components with hollow portions where structural protection is needed, while using high-liquidity resin locally to components with narrow electrode pitches where filling completeness is critical. This local quality differentiation resolves the contradiction.
3Ease of manufacture
If the same sealing resin is used for all electronic components, then the manufacturing process is simplified, but it is impossible to simultaneously prevent gaps in narrow-pitch devices and protect hollow portions from crushing
Solution Approach 1:
The patent segments the sealing resin into two distinct types applied in sequence: first the high-liquidity resin to fill narrow spaces and prevent gaps, then the low-liquidity resin to seal and protect hollow portions. This segmentation improves reliability by addressing both critical requirements, accepting increased manufacturing complexity as a necessary trade-off.
Solution Approach 2:
The patent uses a composite approach by combining two different sealing resins with complementary properties in a multi-step sealing process. This composite material strategy resolves the contradiction between manufacturing simplicity and sealing quality by leveraging the strengths of each resin type for different functional requirements.
Data Source
AI summary
An electronic module includes a substrate, at least one first electronic component that includes a hollow portion, at least one second electronic component that includes no hollow portion, a first sealing resin, and a second sealing resin. The at least one first electronic component is sealed with the first sealing resin. The at least one second electronic component has a narrowest pitch between the electrodes that are provided on the mounting surface, and at least the mounting surface including the electrodes of the at least one second electronic component are sealed with the second sealing resin. The volume percentage of a filler that is included in the first sealing resin is larger than the volume percentage of a filler that is included in the second sealing resin.