Dual-Sensor Package Structure With Light Barrier Isolation
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Solution Overview
Problem
Conventional sensor package structures lack a mechanism to separate multiple sensor chips, leading to mutual interference and misjudgments.
Innovation Solution
A sensor package structure incorporating a substrate, sensor chips, ring-shaped supporting layers, a light-permeable layer, and a light block barrier, with the light block barrier fixed to the light-permeable layer to separate the sensor chips and prevent interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If sensor chips are disposed close together in a conventional sensor package structure, then the device complexity is reduced and manufacturing is simplified, but the sensor chips interfere with each other causing measurement errors
Solution Approach 1:
The patent introduces a light blocking structure that segments the package into separate optical zones for each sensor chip. This light blocking structure divides the shared encapsulant space into isolated optical paths, preventing cross-talk between adjacent sensor chips while maintaining their close physical arrangement for compact packaging.
Solution Approach 2:
The light blocking structure acts as an intermediary element positioned between adjacent sensor chips within the encapsulant. It selectively blocks stray light from reaching neighboring sensor chips while allowing necessary light to reach each sensor's active area, thus mediating the optical interaction between closely spaced sensors.
2Measurement precision
If a light blocking structure is added to separate sensor chips, then measurement precision is improved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The light blocking structure is merged with the existing encapsulant and sensor chip assembly. Rather than being a separate complex component, it is integrated into the package structure during the encapsulation process, combining the functions of optical isolation with the protective encapsulant function.
Solution Approach 2:
The light blocking structure changes the optical parameters (light transmission properties) within the encapsulant space. By introducing materials with different optical absorption characteristics, it creates distinct optical environments for each sensor chip without requiring physical separation of the chips themselves.
3Measurement precision
If a light blocking structure is added to prevent interference between sensor chips, then measurement precision is improved, but the manufacturing process becomes more difficult
Solution Approach 1:
The light blocking structure is prepared and positioned in advance during the package assembly process, before final encapsulation. This preliminary placement ensures proper alignment and positioning, simplifying the overall manufacturing process by avoiding complex post-assembly adjustments.
Solution Approach 2:
The light blocking structure serves multiple functions simultaneously: it provides optical isolation between sensor chips, structural support within the encapsulant, and defines optical paths. This multi-functionality reduces the need for additional separate components, simplifying manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively prevents sensor chips from affecting each other by using a light block barrier, ensuring accurate operation.
Implementation Method 1
The light block barrier is arranged between the two sensor chips
Implementation Method 2
The light-permeable layer has an inner surface, an outer surface, and a surrounding lateral surface that is connected to the inner surface and the outer surface
Data Source
AI summary
A sensor package structure includes a substrate, a ring-shaped frame formed on the substrate, two sensor chips disposed on the substrate, a light-permeable layer disposed on the ring-shaped frame, and a light block barrier. The ring-shaped frame defines a chip receiving slot therein. The two sensor chips are located in the chip receiving slot and are electrically coupled to the substrate. The light-permeable layer is disposed on the ring-shaped frame through an inner surface thereof so as to enclose the chip receiving slot and a space surrounded by the chip receiving slot. The top side of the light block barrier is fixed onto the inner surface of the light-permeable layer. The light block barrier is located in the chip receiving slot and is arranged between the two sensor chips.