Dual Sensor Mold Packaging Stress Compensation
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Solution Overview
Problem
Sensors in electronic devices are sensitive to mechanical stress during packaging, which can affect their functionality and accuracy in measuring physical variables like pressure or gas composition, leading to distorted sensor signals.
Innovation Solution
The solution involves integrating two sensors in a device, where one sensor is sealed to prevent measurement of the variable and only measures mechanical stress caused by the packaging material, while the other sensor is exposed to measure the desired variable. A semiconductor chip processes these signals to compensate for the stress-induced distortion, producing a signal that is substantially free from packaging-related errors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sensors are packaged in mold material, then the sensors are protected and integrated into the device, but the sensors experience mechanical stress that distorts their measurement signals
Solution Approach 1:
A reference sensor is introduced as an intermediary element that experiences the same mechanical stress as the measurement sensor but is isolated from the measured variable. This reference sensor acts as a mediator to capture and quantify the stress-induced signal distortion, enabling subsequent compensation of the measurement sensor's output.
Solution Approach 2:
The system implements feedback by using the reference sensor's stress measurement to compensate for the measurement sensor's signal. The processor continuously monitors the reference sensor's output and applies this information to correct the measurement sensor's readings, creating a closed-loop compensation mechanism that eliminates stress-induced errors.
2Measurement precision
If a reference sensor is added to compensate for stress, then measurement accuracy is improved, but device complexity increases
Solution Approach 1:
The reference sensor serves multiple functions: it acts as a stress compensation sensor, provides a reference signal for the processor, and enables the system to differentiate between stress-induced signal changes and actual measured variable changes. This multi-functionality justifies the addition of the sensor by maximizing its utility within the system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures that the sensor signals are free from mechanical stress-induced distortions, providing accurate measurements of the desired physical variables, similar to those obtained without packaging stress, by calculating the difference between the two sensor signals.
Implementation Method 1
a first sensor (10) having a first sensor surface (12) which is exposed to allow sensing of a first variable
Implementation Method 2
a second sensor (11) having a second sensor surface (13) which is sealed to inhibit sensing of the first variable, wherein the second sensor is configured to detect a stress caused by the mold material
Implementation Method 3
A semiconductor chip processes these signals to compensate for the stress-induced distortion, producing a signal that is substantially free from packaging-related errors
Data Source
AI summary
A sensor device. One embodiment provides a first sensor having a first sensor surface. The first sensor surface is exposed to allow sensing of a first variable. A second sensor has a second sensor surface. The second sensor surface is sealed to inhibit sensing of the first variable, and a mold material is embedded the first and second sensors.