Dual-Sensor Temperature Control for Semiconductor Wafer Heating

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Solution Overview

Problem

Existing heat treatment apparatuses for semiconductor wafers fail to accurately control the temperature of wafers during the film forming process due to the inability to accurately measure the temperature while the rotary table is rotating, leading to inconsistent film formation.

Innovation Solution

A heat treatment apparatus equipped with both a contact-type temperature measuring part for the heating part and a non-contact type temperature measuring part for the substrate, allowing for simultaneous measurement and control of the substrate temperature during rotation, ensuring precise temperature control.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a non-contact type temperature measuring part is used to measure the substrate temperature during rotation, then the substrate temperature can be measured, but the measurement accuracy is insufficient without combined control

Engineering Contradiction:

Improvesubstrate temperature measurement during rotationVSAvoidfilm formation consistency

Core Design Contradiction:

Measurement precisionVSManufacturing precision

Solution Approach 1:

The temperature control part receives temperature information from both the contact-type temperature measuring part (heating part temperature) and the non-contact type temperature measuring part (substrate temperature). This dual-feedback mechanism allows the system to comprehensively control the substrate temperature by considering both the heating source temperature and the actual substrate temperature, thereby ensuring consistent film formation and resolving the measurement accuracy issue.

Inventive Principle:

Principle #23Feedback

2Ease of operation

If only heater temperature control is used, then the heater can be controlled, but the substrate temperature cannot be accurately controlled during film forming

Engineering Contradiction:

Improveheater controlVSAvoidsubstrate temperature control during film forming

Core Design Contradiction:

Ease of operationVSManufacturing precision

Solution Approach 1:

The system implements dual-feedback temperature control by incorporating both a contact-type temperature measuring part for the heating part and a non-contact type temperature measuring part for the substrate. The temperature control part processes information from both sensors to comprehensively control the substrate temperature during film forming, ensuring manufacturing precision while maintaining ease of operation.

Inventive Principle:

Principle #23Feedback

Solution Approach 2:

The system replaces pure mechanical contact measurement with a combination of contact-type and non-contact type measurement methods. The non-contact type temperature measuring part uses radiation detection to measure substrate temperature without physical contact, allowing accurate measurement during rotation while the contact-type sensor monitors the heating part, together enabling precise substrate temperature control.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables accurate temperature control of substrates during the film forming process, ensuring consistent film formation and improving the overall efficiency of the heat treatment process.

Implementation Method 1

a first temperature measuring part of a contact-type configured to measure a temperature of the heating part

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a second temperature measuring part of a non-contact type configured to measure a temperature of the substrate mounted on the rotary table

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS11656126B2Heat treatment apparatus and temperature control method

Publication Date: 2023.05.23 TOKYO ELECTRON LTD

AI summary

There is provided a heat treatment apparatus for performing a predetermined film forming process on a substrate by mounting the substrate on a surface of a rotary table installed in a processing vessel and heating the substrate by a heating part while rotating the rotary table. The heat treatment apparatus includes: a first temperature measuring part of a contact-type configured to measure a temperature of the heating part; a second temperature measuring part of a non-contact type configured to measure a temperature of the substrate mounted on the rotary table in a state where the rotary table is being rotated; and a temperature control part configured to control the heating part based on a first measurement value measured by the first temperature measuring part and a second measurement value measured by the second temperature measuring part.