Dual Shell Housing with Fan for Heat Transport

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Solution Overview

Problem

Conventional double shell housings for electronic devices in outdoor environments face inefficiencies in heat transportation due to exposure of fans and electronics to harsh environments, leading to damage and ineffective temperature regulation.

Innovation Solution

A housing design featuring a first shell with openings for gaseous fluid flow, a second shell enclosing the first, and at least one fan to enhance heat transport between shells, with temperature sensors and control units to manage fan operation and minimize power consumption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If fans are provided between inner and outer shell to improve heat transport, then heat transportation efficiency is improved, but fans and electronics are exposed to outside environment causing damage in cold and damp conditions

Engineering Contradiction:
Improveheat transportation efficiencyVSAvoidfan and electronics durability
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The housing is divided into two separate shells: an inner shell that remains hermetically sealed to protect electronics, and an outer shell that interfaces with the environment. The fan is positioned in the sealed inner shell, segmented from the external environment, thus maintaining reliability while enabling heat transport function.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A hermetically sealed inner shell acts as an intermediary barrier between the fan/electronics and the external environment. This intermediary structure allows the fan to operate in a protected environment while still achieving heat transport to the outer shell, resolving the contradiction between functionality and protection.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If a single sealed shell is used to protect electronic devices, then protection from environment is improved, but heat generated by electronic device conducts through shell causing overheating in hot environments

Engineering Contradiction:
Improvedevice protectionVSAvoidinternal temperature control
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The single sealed shell is segmented into two shells: an inner sealed shell for device protection and an outer shell for environmental interaction. This segmentation allows the inner shell to maintain protection while the outer shell provides heat dissipation pathways through convection and radiation, solving both protection and temperature control requirements.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The solution moves from one-dimensional protection (single shell) to two-dimensional thermal management (inner shell for protection, outer shell for heat dissipation). The outer shell provides additional thermal management dimensions through natural convection and solar reflectivity, enabling temperature control without compromising inner shell sealing.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Temperature

If air between shells is used for insulation in cold environments, then heat retention is improved, but natural convection is ineffective when internal temperature is not higher than external temperature

Engineering Contradiction:
Improveheat retentionVSAvoidheat transport effectiveness
Core Design Contradiction:
TemperatureVSProductivity

Solution Approach 1:

The system dynamically adapts between two modes: passive insulation mode where stationary air provides thermal resistance, and active convection mode where the fan drives air circulation. This dynamic capability allows the system to optimize for heat retention when needed and effective heat transport when internal temperature exceeds external temperature, resolving the contradiction between insulation and productivity.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design optimizes temperature control in both cold and hot environments by improving heat transport and insulation, reducing power consumption, and extending fan lifespan through controlled operation and a single electrical connection for power and communication.

Implementation Method 1

at least a first fan is arranged such that it is capable of providing a flow of the gaseous fluid through the at least one opening in the first shell to the second shell and thereby provide heat transport from the electronic device to the second shell

Methodology Applied
Scientific EffectForced Convection: Forced Convection

Implementation Method 2

the gaseous fluid between the shells functions as a heat insulator. When the surrounding environment is cold, and the fan is off, a layer of gaseous fluid is kept between the shells to keep the heat inside the first shell

Methodology Applied
Scientific EffectThermal Insulation: Thermal Insulation

Implementation Method 3

a heating element arranged between the first and second shell. The heating element is configured to heat the gaseous fluid between the first and second shell when the fan is not running

Methodology Applied
Scientific EffectJoule Heating: Joule Heating

Data Source

PatentUS8537549B2Housing for electronic device
Publication Date: 2013.09.17 AXIS
  • US8537549B2 patent drawing
  • US8537549B2 patent drawing
  • US8537549B2 patent drawing

AI summary

A housing for an electronic device. The housing includes a first shell at least partly enclosing the electronic device, a second shell, and at least a first fan. The first shell is arranged to allow a gaseous fluid to surround the electronic device. The second shell at least partly encloses the first shell, and is arranged in relation to the first shell such that the gaseous fluid may be present between the shells. The at least first fan is arranged in an opening of the first shell such that it is capable of providing a flow of the gaseous fluid through the opening in the first shell of the gaseous fluid to the second shell and thereby provide heat transport from the electronic device to the second shell.