Dual Shower Head Layout for Uniform Supercritical Substrate Processing
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Solution Overview
Problem
Existing substrate processing methods using supercritical fluids face challenges such as particle defects during the manufacturing of semiconductor devices due to the collapse of photoresist patterns and non-uniform processing.
Innovation Solution
A substrate processing apparatus and method that includes a processing container with a substrate support, a fluid supply device, and a shower head assembly with distinct diameters, forming a flow path between the container and the shower head assembly, to uniformly distribute supercritical fluids and reduce hydraulic pressure on the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single shower head is used to supply supercritical fluid, then the device structure is simple, but the fluid distribution uniformity is poor
Solution Approach 1:
The single shower head is divided into multiple shower heads (first shower head and second shower head) with different diameters. This segmentation allows the supercritical fluid to be distributed through multiple paths, improving the uniformity of fluid distribution across the substrate surface while maintaining a relatively simple overall structure.
Solution Approach 2:
Different shower heads are designed with different diameters to create local quality variations in the fluid distribution system. The first shower head has a larger diameter for broader coverage, while the second shower head has a smaller diameter for more focused distribution, allowing each region to receive appropriately sized fluid streams for optimal uniformity.
2Productivity
If shower head is close to substrate, then processing efficiency is high, but hydraulic pressure on substrate increases causing pattern collapse
Solution Approach 1:
The fluid supply is segmented into multiple shower heads at different positions and diameters. This segmentation distributes the hydraulic load across multiple smaller fluid streams rather than one large stream, reducing the peak hydraulic pressure on the substrate while maintaining processing efficiency through comprehensive coverage.
Solution Approach 2:
The diameter parameter of the shower heads is varied (first shower head has larger diameter, second has smaller diameter) to control the fluid flow characteristics. This parameter change allows optimization of both the fluid distribution coverage and the pressure exerted on the substrate, preventing pattern collapse while maintaining processing efficiency.
3Productivity
If fluid flow rate is increased to improve processing speed, then productivity increases, but particle defects increase due to non-uniform flow
Solution Approach 1:
The high flow rate fluid supply is segmented into multiple smaller streams through the first and second shower heads. This segmentation maintains the total processing speed by delivering equivalent total fluid volume, but distributes it in a more uniform manner across the substrate, preventing the non-uniform flow patterns that cause particle defects.
Solution Approach 2:
Different regions of the substrate receive fluid from shower heads with different diameters, creating local quality variations in the fluid application. This ensures that each local region receives an appropriate flow rate that maintains processing speed while avoiding the excessive localized flow that would generate particle defects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus and method improve substrate processing uniformity and reduce particle defects by dispersing the fluid flow, maintaining pattern integrity and preventing substrate damage.
Implementation Method 1
a shower head assembly configured to diffuse the processing fluid supplied from the fluid supply device into the processing space
Implementation Method 2
a fluid supply device configured to supply a processing fluid in a supercritical state to the processing space
Data Source
AI summary
A substrate processing apparatus including a processing container including a processing space, a substrate support extending in a first direction and a second direction perpendicular to the second direction, and configured to support a substrate in the processing container, a fluid supply device configured to supply a processing fluid in a supercritical state to the processing space through a container supply pipe, and a shower head assembly configured to diffuse the processing fluid supplied from the fluid supply device into the processing space. The shower head assembly includes a first shower head having a first diameter, and a second shower head arranged between the first shower head and the substrate and having a second diameter. The processing container is separated from the shower head assembly in a third direction perpendicular to the first direction and the second direction, such that a flow path is formed between the processing container and the shower head assembly.