Dual-Side Adhesive Structure for Simultaneous ACF Bonding
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Solution Overview
Problem
The conventional manufacturing process for liquid crystal displays (LCDs) is complicated by the need for sequential attachment of two anisotropic conductive films, which requires reserved space and increases the size of the outer lead bonding area due to the distance between integrated circuits and flexible printed circuits, leading to potential bonding damages and reduced yield.
Innovation Solution
An adhesive structure comprising a releasing paper with a first and second anisotropic conductive film formed on separate areas, allowing simultaneous attachment onto the panel, eliminating the need for sequential steps and reducing the space required between the integrated circuit and flexible printed circuit, thereby minimizing the outer lead bonding area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If two anisotropic conductive films are attached sequentially onto the panel, then each film can be properly positioned and bonded, but the manufacturing process becomes complicated and requires reserved space between components
Solution Approach 1:
The patent combines two separate anisotropic conductive films onto a single panel in one manufacturing step by using a dual-sided adhesive tape structure. The first anisotropic conductive film is positioned on the first surface while the second anisotropic conductive film is positioned on the second surface of the same tape, allowing both to be attached simultaneously to the panel without requiring sequential operations or reserved spaces between them.
Solution Approach 2:
The adhesive tape serves as an intermediary carrier that holds both anisotropic conductive films in precise positions. The tape structure with its first surface and second surface provides a stable base for positioning both films, eliminating the need for reserved space between components while maintaining attachment precision.
2Manufacturing precision
If reserved space is allocated between integrated circuit and flexible printed circuit, then bonding accuracy can be maintained, but the outer lead bonding area size increases
Solution Approach 1:
The patent merges the positioning and bonding functions by using a dual-sided adhesive tape that simultaneously holds both the integrated circuit and flexible printed circuit in precise positions. This eliminates the need for reserved space between components while maintaining bonding accuracy, as the tape structure itself provides the precise positioning interface.
3Reliability
If metallic connection is used to bond integrated circuit onto panel, then high conductivity is achieved, but high temperature welding may damage components and circuit shorting occurs
Solution Approach 1:
The patent changes the bonding method from high-temperature metallic welding to low-temperature adhesive bonding using anisotropic conductive films. The adhesive material provides sufficient electrical conductivity without requiring high temperature, thereby avoiding component damage and circuit shorting while maintaining reliable electrical connection.
Solution Approach 2:
The patent uses composite anisotropic conductive films that combine conductive particles with adhesive material. This composite structure provides both electrical conductivity and adhesive bonding properties, eliminating the need for separate metallic welding and adhesive bonding steps, and avoiding the harmful effects of high-temperature welding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, reduces the size of the LCD, and ensures accurate bonding by allowing both films to be applied in a single step, shortening the distance between the integrated circuit and flexible printed circuit, and minimizing the outer lead bonding area.
Implementation Method 1
the anisotropic conductive film mainly comprises conductive particles and an isolation adhesive material... the isolation adhesive material will solidify to provide perpendicular conduction, lateral isolation and adhesive connection
Implementation Method 2
the isolation adhesive material will solidify to provide perpendicular conduction, lateral isolation and adhesive connection
Data Source
AI summary
An adhesive structure for use in a liquid crystal display (LCD) and a method for manufacturing the adhesive structure are provided. The adhesive structure includes a releasing paper which is provided with two anisotropic conductive films (ACFs) thereon. When the adhesive structure is attached onto the LCD, the two ACFs can be simultaneously attached onto the glass substrate of the LCD for connecting the integrated circuit and flexible printed circuit, respectively.