Dual-Side Conductive Frame for IC Packaging Density
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Solution Overview
Problem
Current integrated circuit packaging systems face challenges in achieving miniaturization, increased density, performance, and cost reduction, particularly in portable devices, as they struggle to efficiently integrate more functions while maintaining reliability and reducing physical size and cost.
Innovation Solution
The proposed solution involves a method of manufacturing an integrated circuit packaging system that includes mounting an integrated circuit over a package carrier, pressing an encapsulation onto the carrier, and forming a conductive frame with a vertical pillar integral to a horizontal cover, which provides improved chip interconnection and space savings through a dual-side connection configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If integrated circuits are stacked into a single package, then packaging density is increased, but manufacturing complexity and reliability challenges increase
Solution Approach 1:
The package is divided into a package carrier and a separate conductive frame assembly. The conductive frame is detached from traditional mold compound and can be independently manufactured and assembled, simplifying the manufacturing process while enabling higher packaging density through vertical stacking configurations.
Solution Approach 2:
The conductive frame transitions from a planar, two-dimensional structure embedded in mold compound to a three-dimensional structure with vertical pillars extending through the package. This vertical dimension enables direct electrical connections between stacked integrated circuits, increasing packaging density without proportionally increasing manufacturing complexity.
2Volume of moving object
If component size is reduced for miniaturization, then device portability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The conductive frame is pre-formed with integrated vertical pillars and contact structures before assembly. This preliminary formation of connection structures eliminates the need for precise post-assembly alignment and bonding operations, reducing manufacturing precision requirements while enabling miniaturized package designs.
Solution Approach 2:
The conductive frame acts as an intermediary structure between the package carrier and integrated circuits. It provides pre-configured electrical pathways and mechanical support, reducing the precision requirements for direct IC-to-carrier connections and enabling smaller package dimensions.
3Adaptability or versatility
If more integrated circuits are integrated into a package, then functionality is increased, but physical space requirements increase
Solution Approach 1:
The package architecture transitions from a two-dimensional planar layout to a three-dimensional vertical stacking configuration. The conductive frame with vertical pillars enables electrical connections through the vertical dimension, allowing multiple integrated circuits to be stacked above and below the package carrier, thereby increasing functionality without increasing the package footprint area.
Solution Approach 2:
Multiple integrated circuits are nested vertically within the package structure, with each circuit stacked above or below the package carrier. The conductive frame provides the nesting framework with vertical pillars that penetrate through encapsulation layers to establish electrical connections between nested circuits, maximizing functionality within limited physical space.
4Ease of manufacture
If traditional mold compound encapsulation is used, then manufacturing simplicity is maintained, but electrical connection reliability and density are limited
Solution Approach 1:
The conductive frame is segmented from the mold compound encapsulation, allowing independent optimization of each component. The conductive frame can be precisely manufactured with controlled electrical properties and mechanical strength for reliable connections, while the mold compound focuses solely on protective encapsulation, maintaining manufacturing simplicity through separate fabrication processes.
Solution Approach 2:
The package employs a composite structure combining mold compound for environmental protection and a separate conductive frame material (such as metal or conductive polymer) for electrical connections. This composite approach allows each material to be optimized for its specific function, improving electrical connection reliability while maintaining ease of manufacture through specialized processing for each material type.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: mounting an integrated circuit over a package carrier; pressing an encapsulation onto the package carrier and with the integrated circuit therein; mounting a conductive frame, having a vertical pillar integral with a horizontal cover, through the encapsulation, over the integrated circuit, and the vertical pillar on the package carrier and the horizontal cover on the encapsulation; and forming a contact from the horizontal cover.