Dual-Side Cooling Power Module Packaging

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing integrated circuit packages, such as QFN and DFN, face challenges in efficiently dissipating heat from high-power devices like power MOSFETs, which limits their compactness and performance in applications requiring dual-side cooling.

Innovation Solution

A compact packaging solution that utilizes dual-side cooling by mounting power MOSFETs with their drain regions coupled to separate leadframes on both top and bottom surfaces, allowing heat to be efficiently dissipated through exposed regions, and incorporating a driver control logic module in a single small form-factor package.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If power MOSFETs are mounted in traditional side-by-side configuration, then electrical connection is achieved, but heat dissipation efficiency deteriorates and package volume increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidpackage volume

Core Design Contradiction:

TemperatureVSVolume of moving object

Solution Approach 1:

The patent transitions from traditional side-by-side mounting in a single plane to a three-dimensional configuration where power MOSFETs are mounted on both the top and bottom surfaces of the leadframe. This spatial arrangement enables heat to be dissipated from both the top and bottom of the package, effectively utilizing both sides for thermal management and reducing the overall package volume by 38% while maintaining efficient heat dissipation.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Temperature

If power MOSFETs are mounted on both top and bottom surfaces, then heat dissipation efficiency improves, but manufacturing complexity increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidmanufacturing complexity

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The patent divides the power MOSFET mounting into separate segments: devices mounted on the top surface with drain regions coupled to a first leadframe, and devices mounted on the bottom surface with drain regions coupled to a second leadframe. This segmentation allows each surface to be independently managed and processed, simplifying the overall manufacturing process despite the three-dimensional configuration.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The leadframe structure is designed to serve multiple functions: it provides electrical connection for power MOSFETs, acts as a heat dissipation path, and enables both top and bottom surface mounting. The exposed regions of the leadframe on both surfaces serve as heat dissipation structures, eliminating the need for separate heat sinks and reducing overall component count.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Temperature

If exposed leadframe regions are used for heat dissipation, then thermal management efficiency improves, but electrical connection reliability may deteriorate

Engineering Contradiction:

Improvethermal management efficiencyVSAvoidelectrical connection reliability

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent applies different properties to different regions of the leadframe: regions that require electrical connection are designed with appropriate plating and bonding surfaces, while exposed regions are optimized for heat dissipation. This local differentiation ensures that electrical connection reliability is maintained at contact points while thermal management efficiency is maximized at exposed surfaces.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables efficient heat dissipation in both directions, reducing package volume by 38% compared to traditional side-by-side mounting, while maintaining effective thermal management and compactness.

Implementation Method 1

mounting power MOSFETs with their drain regions coupled to separate leadframes on both top and bottom surfaces, allowing heat to be efficiently dissipated through exposed regions

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9620440B1Power module packaging with dual side cooling

Publication Date: 2017.04.11 TEXAS INSTRUMENTS INC

AI summary

A multichip package includes a first semiconductor device mounted on a first leadframe, in which a primary heat producing surface of the first semiconductor device is oriented towards and in contact with a heat dispersing region of the first leadframe. A second semiconductor device is mounted on a second leadframe, in which a primary heat producing surface of the second semiconductor device is oriented towards and in contact with a heat dispersing region of the second leadframe. A surface of the heat dispersing region of the first leadframe is exposed on a first side of the multichip package, and a surface of the heat dispersing region of the second leadframe is exposed on a second side of the multichip package that is opposite from the first side.