Dual-Side Copper Plating System for Flexible Films
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Solution Overview
Problem
Conventional copper plating and cleaning apparatuses for manufacturing flexible copper clad laminate (FCCL) films have low productivity and efficiency in producing FCCLs with copper plating layers on both surfaces, and are difficult to repair and maintain due to complex components and configurations.
Innovation Solution
A system and method for continuously electroplating both surfaces of a polyimide-based film using a pickling device to remove oxide coatings, water-cleaning devices to remove pickling and copper electrolyte, plating devices to form copper layers, an antirust device to prevent rusting, and a drying device to dry the antirust liquid, with a focus on simplifying the apparatus design for easier maintenance and cleaning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional copper plating apparatuses are used to electroplate only one surface of the polyimide-based film, then the apparatus structure is simple, but the productivity is low and cannot meet the demand for multilayered FPCBs requiring copper plating on both surfaces
Solution Approach 1:
The plating bath is divided into two separate plating sections, each equipped with independent electrodes and spray nozzles, allowing simultaneous plating of both film surfaces. This segmentation enables dual-sided plating operations without requiring complex reconfiguration of a single bath system.
Solution Approach 2:
The apparatus transitions from single-sided plating to dual-sided plating by adding the dimension of simultaneous opposite surface treatment. The film passes through the plating bath with both surfaces exposed to plating conditions, effectively utilizing the third dimension (film thickness) for parallel processing.
2Ease of repair
If conventional copper plating apparatuses with multiple components including electrodes, feed rolls, and spray nozzles are installed in the plating bath, then the plating function is complete, but the apparatus is difficult to repair and maintain due to the large number of components and electrical lines
Solution Approach 1:
The lateral walls of the plating bath are designed to be movable rather than fixed, allowing them to slide open for access to internal components. This dynamic structure enables easy maintenance of electrodes, spray nozzles, and feed rolls without requiring complete disassembly of the apparatus.
Solution Approach 2:
The movable lateral wall design effectively extracts the barrier function from a fixed structure, allowing temporary removal of the wall obstruction to access components. This separates the containment function from the access function, enabling easy maintenance while maintaining operational integrity.
3Ease of manufacture
If conventional copper plating apparatuses with multiple components and electrical lines are used, then the plating process is functional, but the plating bath is difficult to clean due to the complex configuration of components and connections
Solution Approach 1:
The movable lateral walls allow the plating bath to transition from a closed operational state to an open cleaning state. This dynamic access enables thorough cleaning of the bath interior, electrodes, and components without disassembling the entire apparatus, significantly improving maintenance efficiency.
Solution Approach 2:
By extracting the wall barrier through movable design, the cleaning function is enhanced without adding complex cleaning mechanisms. The open access provided by movable walls allows direct cleaning of all internal surfaces and components, simplifying the cleaning process despite the presence of multiple components.
4Productivity
If conventional apparatuses are used for FCCL manufacturing, then single-sided copper plating can be achieved, but the efficiency in producing FCCLs with copper plating layers on both surfaces is low
Solution Approach 1:
The apparatus enables continuous dual-sided plating as the film passes through the plating bath, with both surfaces receiving copper coating simultaneously in a single continuous operation. This eliminates the need for separate plating operations for each surface, maintaining continuous productive action throughout the process.
Solution Approach 2:
The plating bath is segmented into two independent plating zones with separate electrode assemblies and spray systems, allowing each zone to operate independently on one film surface. This segmentation enables simultaneous but independent plating operations, doubling the effective productivity without requiring complex coordination.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system efficiently forms copper plating layers on both surfaces of the FCCL film, improving productivity and ease of maintenance by simplifying the apparatus design and ensuring effective cleaning and rust prevention.
Implementation Method 1
a pickling device adapted to spray a pickling liquid to both surfaces of the to-be-plated film to remove oxide coatings from the copper coatings
Implementation Method 2
at least one plating device positioned between the water-cleaning devices to form copper plating layers on both surfaces of the film
Implementation Method 3
a plating step of forming copper plating layers, including copper nuclei, on the copper coatings using a copper electrolyte as the working fluid
Implementation Method 4
a drying device for drying the antirust liquid on the film, which has been subjected to antirust treatment
Data Source
AI summary
Disclosed is a system and a method for manufacturing flexible copper clad laminate film capable of efficiently electroplating both surfaces of a polyimide-based film to form copper plating layers thereon while making it easy to repair and maintain the apparatus or clean its plating or cleaning bath. The system includes a pickling device adapted to spray a pickling liquid to both surfaces of a to-be-plated film to remove oxide coatings from the copper coatings; a number of water-cleaning devices for removing the pickling liquid and copper electrolyte remaining on the film; at least one plating device positioned between the water-cleaning devices to form copper plating layers on both surfaces of the film; an antirust device for preventing the copper plating layers, which have been formed by the plating device, from rusting; and a drying device for drying the antirust liquid on the film, which has been subjected to antirust treatment.