Dual-Side Cooled Semiconductor Package for Direct Die Heat Transfer
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Solution Overview
Problem
Existing semiconductor packaging systems face challenges in efficiently managing heat dissipation and electrical connectivity for power semiconductor die, particularly in high-power applications where thermal performance and compact design are critical.
Innovation Solution
The proposed semiconductor package design incorporates dual side direct cooling through the direct coupling of heat sinks to source and drain pads of die modules, along with a coating to protect the die module from coolant exposure, and immersion cooling to enhance heat transfer and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional semiconductor packaging is used, then electrical connectivity is maintained, but thermal performance deteriorates due to indirect heat transfer paths
Solution Approach 1:
The patent extracts the substrate layer from the traditional semiconductor packaging structure, creating a substrate-less design where power semiconductor die are directly mounted on heat sinks. This elimination of the substrate removes the thermal resistance barrier, enabling direct metal-to-metal heat transfer from the die to the heat sink, thereby significantly improving thermal performance while simplifying the overall packaging structure.
Solution Approach 2:
The patent transitions from a single-sided cooling architecture to a dual-sided cooling configuration, where heat sinks are attached to both the top and bottom surfaces of the power semiconductor die. This dimensional change in thermal management architecture creates parallel heat dissipation paths, effectively doubling the thermal management capacity and resolving the thermal performance limitation of traditional single-sided cooling designs.
2Loss of energy
If heat sinks are directly coupled to die pads, then heat transfer efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The patent applies preliminary action by pre-attaching heat sinks to the power semiconductor die during the die bonding process, before the modules are assembled into the final packaging structure. This early integration of heat sinks establishes direct thermal contact pathways upfront, ensuring optimal heat transfer efficiency from the moment the die are mounted, while simplifying subsequent assembly operations and reducing overall manufacturing complexity.
3Temperature
If immersion cooling is implemented, then thermal management is enhanced, but protection of die module from coolant becomes challenging
Solution Approach 1:
The patent applies local quality by providing selective coating protection only on specific surfaces of the power semiconductor die that are exposed to the dielectric coolant in immersion cooling applications. Rather than coating the entire die structure, the coating is applied locally to the lateral surfaces and any other coolant-exposed areas, maintaining thermal performance on the heat sink contact surfaces while providing corrosion and contamination protection where the coolant contacts the die, thus balancing thermal management enhancement with die module protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly improves thermal performance by enabling direct metal-to-metal heat transfer and immersion cooling, while maintaining compactness and efficient electrical connectivity, thus addressing the limitations of traditional packaging systems.
Implementation Method 1
enabling direct metal-to-metal heat transfer
Implementation Method 2
immersion cooling to enhance heat transfer
Implementation Method 3
enabling direct metal-to-metal heat transfer
Implementation Method 4
immersion cooling to enhance heat transfer
Data Source
AI summary
Implementations of a semiconductor package may include one or more power semiconductor die included in a die module; a first heat sink directly coupled to one or more source pads of the die module; a second heat sink directly coupled to one or more drain pads of the die module; a gate contact coupled with one or more gate pads of the die module; and a coating coupled directly to the die module. The gate contact may be configured to extend through an immersion cooling enclosure.