Dual-Side IC Package with Adhesive Encapsulation for EMI Management
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Solution Overview
Problem
Current integrated circuit package technologies face challenges in reducing package dimensions, increasing integration density, and reducing manufacturing costs while effectively managing electromagnetic interference (EMI) and ensuring reliable connectivity as more integrated circuits are packed into smaller spaces.
Innovation Solution
The proposed solution involves connecting an integrated circuit die with a bottom connection structure, applying an adhesive encapsulation that exposes the bottom connection structure, and placing a top connection structure on the opposing side, which provides dual connection options and mechanical rigidity, while also serving as a redistribution layer for external connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If more integrated circuits are packed into a single package, then integration density increases, but package height reduction is limited due to space requirements for electrical connections and spacers
Solution Approach 1:
The patent transitions from vertical stacking to horizontal dual-sided connection, utilizing both top and bottom surfaces of the package substrate for electrical connections. This dimensional change eliminates the need for vertical spacers and bond wires, enabling significant package height reduction while maintaining high integration density.
Solution Approach 2:
The patent extracts and eliminates the spacer structures (silicon or interposers) that traditionally occupy vertical space in multi-chip packages. By removing these intermediate components and directly connecting chips to the package substrate, the design achieves height reduction without compromising electrical connectivity.
2Reliability
If conventional vertically stacked multi-chip packages are used, then electrical connections are formed, but additional manufacturing steps and structures increase manufacturing costs and decrease manufacturing yields
Solution Approach 1:
The package substrate itself provides the connection functionality, eliminating the need for separate spacer structures. The substrate's own surfaces are utilized for both mechanical support and electrical connection, reducing manufacturing steps and improving yields while maintaining reliable electrical connectivity.
Solution Approach 2:
The package substrate serves multiple functions simultaneously: mechanical support, electrical connection, and signal distribution. By making the substrate multi-functional, the design eliminates the need for dedicated spacer structures, simplifying manufacturing and reducing costs.
3Object-affected harmful factors
If conductive enclosures are provided to shield integrated circuits from EMI, then electromagnetic interference is reduced, but manufacturing complexity, cost, and package size increase
Solution Approach 1:
The patent removes the need for separate conductive enclosure structures by integrating EMI shielding functionality into the package substrate itself. The substrate's ground planes and conductive layers provide inherent EMI protection without requiring additional shielding components, thereby reducing manufacturing complexity and package size.
Solution Approach 2:
The EMI shielding function is merged with the package substrate structure. The substrate simultaneously provides mechanical support, electrical connection, and EMI shielding through its conductive ground planes, eliminating the need for separate shielding enclosures and reducing overall package complexity.
Data Source
AI summary
A method for manufacturing an integrated circuit package system includes: connecting an integrated circuit die with a bottom connection structure; placing an adhesive encapsulation over the integrated circuit die and the bottom connection structure with the bottom connection structure exposed; and placing a top connection structure over the adhesive encapsulation at an opposing side to the bottom connection structure.