Dual-Side LED Electrode Structure for Faster Installation
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Solution Overview
Problem
The installation of light emitting diodes (LEDs) is time-consuming due to the need for precise electrode placement on one side, which complicates the integration with other electronic elements.
Innovation Solution
A method for manufacturing LEDs involving a stacked semiconductor structure with etched N- and P-semiconductor layers, followed by the formation of electrodes and conductive layers, and a packaging process that includes a conductive substrate to facilitate faster and more convenient electrical connections, allowing for quicker installation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If electrodes are placed on one side of the LED, then the LED structure is simplified, but the installation time increases
Solution Approach 1:
The patent divides the LED structure into distinct segments: a first electrode on the first substrate, a light-emitting layer, and a second electrode on the second substrate. This segmentation allows each electrode to be independently positioned on opposite sides, enabling simultaneous electrical connection to multiple electronic elements without complicating the overall structure.
Solution Approach 2:
The patent transitions from a single-sided electrode configuration to a dual-sided configuration by adding the second electrode on the opposite side of the light-emitting layer. This dimensional change allows electrical connections to be established in both directions, reducing installation time while maintaining structural simplicity.
2Device complexity
If precise electrode placement is required on one side, then the LED can be manufactured with simpler structure, but the integration with other electronic elements becomes complicated
Solution Approach 1:
By segmenting the electrode configuration into two separate electrodes on opposite sides, the patent enables independent integration with different electronic elements. The first electrode can connect to one type of electronic element while the second electrode connects to another, enhancing versatility without requiring complex single-sided electrode arrangements.
Solution Approach 2:
The dual-electrode structure provides multi-functionality by enabling the LED to integrate with various electronic elements on both sides. Each electrode can be independently configured for different connection types, making the LED more adaptable to diverse electronic systems while maintaining a relatively simple overall structure.
3Productivity
If both sides of the diode are electrically connected to other electronic elements, then the installation efficiency improves, but the manufacturing process becomes more complex
Solution Approach 1:
The manufacturing process is segmented into independent steps for forming the first electrode on the first substrate and the second electrode on the second substrate. This segmentation allows each electrode to be manufactured separately using standard techniques, reducing overall manufacturing complexity while enabling dual-sided electrical connections that improve installation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables faster and more convenient installation of LEDs by ensuring that both sides of the diode can be easily electrically connected to other electronic elements, improving the efficiency of the LED manufacturing process.
Implementation Method 1
Light emitting diode (LED) is a semiconductor device for converting current to light
Implementation Method 2
Light emitting diode (LED) is a semiconductor device for converting current to light
Data Source
AI summary
A light emitting diode comprises a light emitting diode chip and a packaging layer. The light emitting diode chip comprises a N-semiconductor layer, a light active layer, and a P-semiconductor layer arranged from a bottom to a top in that sequence, a first electrode, and a second electrode. The first electrode is formed on the P-semiconductor layer. The second electrode is formed on the N-semiconductor layer. The packaging layer covers the light emitting diode chip, and exposes the N-semiconductor layer, the first electrode, and the second electrode. The packaging layer has a through hole separated from a periphery of the light emitting diode chip. A conductive substrate fills the through hole. A first conductive layer is electrically connected to the first electrode and the conductive substrate. The disclosure also provides a method for manufacturing a light emitting diode.