Asymmetric Dual-Side Module Structure for Low-Stress Assembly
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Solution Overview
Problem
Existing semiconductor packages face challenges in reducing stress on components during assembly and manufacturing processes due to overlapping substrates, which can lead to mechanical and electrical inefficiencies and increased thermal resistance.
Innovation Solution
The implementation of a semiconductor package design featuring asymmetrically coupled substrates through electrically conductive spacers, with a lead frame and molding compound encapsulation, reduces stress by allowing non-overlapping perimeters and using conductive materials for electrical coupling, while incorporating heat sinks for improved thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If substrates are overlapped in existing semiconductor packages, then mechanical support is provided, but stress on components increases and thermal resistance increases
Solution Approach 1:
The patent applies asymmetry by designing substrates with non-overlapping perimeters where the first substrate extends beyond the second substrate in certain areas. This asymmetric configuration reduces stress concentration on components while maintaining mechanical support through the lead frame and spacer system, directly resolving the contradiction between providing mechanical support and reducing component stress.
2Stability of the object's composition
If substrates are overlapped in existing semiconductor packages, then structural stability is maintained, but thermal dissipation is reduced
Solution Approach 1:
The patent segments the substrate configuration into non-overlapping regions, allowing each substrate to be positioned independently optimized for thermal management. This segmentation enables better heat dissipation pathways while the lead frame and spacers maintain structural stability, resolving the contradiction between structural stability and thermal dissipation.
3Reliability
If asymmetric substrate coupling is implemented, then stress is reduced and thermal performance improves, but manufacturing complexity increases
Solution Approach 1:
The patent introduces spacers as intermediary elements that facilitate the asymmetric coupling of substrates. These spacers simplify the manufacturing process by providing predefined positioning and alignment features, reducing the complexity that would otherwise arise from direct asymmetric substrate coupling while maintaining the stress reduction and thermal performance benefits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design minimizes stress on components during assembly and processing, enhances electrical and thermal performance, and improves manufacturing efficiency by reducing mechanical overlap and increasing heat dissipation.
Implementation Method 1
The two or more spacers may be made of electrically conductive material and may electrically couple the first substrate to the second substrate
Implementation Method 2
The package may also include a heat sink coupled with the second side of the first die, the second side of the second die, or any combination thereof
Data Source
AI summary
Implementations of semiconductor packages may include: a first substrate having two or more die coupled to a first side, a clip coupled to each of the two or more die on the first substrate and a second substrate having two or more die coupled to a first side of the second substrate. A clip may be coupled to each of the two or more die on the second substrate. The package may include two or more spacers coupled to the first side of the first substrate and a lead frame between the first substrate and the second substrate and a molding compound. A second side of each of the first substrate and the second substrate may be exposed through the molding compound. A perimeter of the first substrate and a perimeter of the second substrate may not fully overlap when coupled through the two or more spacers.