Dual-Side Mold Integrated Circuit Packaging System
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in reducing the size of integrated circuit packages while maintaining performance, reliability, and manufacturing efficiency, with a need for thinner parts and increased functionality without sacrificing speed or requiring complex precision equipment.
Innovation Solution
The method involves a substrate with top and bottom integrated circuits mounted on either side, encapsulated with a top and bottom encapsulation formed simultaneously, and the creation of truncated conic vias through these encapsulations to the substrate, allowing for finer pitches and reduced package warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional separate encapsulation processes are used for top and bottom integrated circuits, then manufacturing complexity increases and production time extends, but encapsulation quality and reliability can be maintained
Solution Approach 1:
The patent combines the encapsulation processes for top and bottom integrated circuits into a single simultaneous operation using a dual-side mold. The mold includes top and bottom halves that enclose both circuits during one curing cycle, eliminating the need for separate encapsulation steps and reducing overall manufacturing complexity while maintaining encapsulation quality
Solution Approach 2:
The dual-side mold is segmented into top and bottom halves that can be separately positioned and aligned. This segmentation allows independent placement of top and bottom integrated circuits while enabling simultaneous encapsulation, thus improving productivity without requiring overly complex integrated tooling
2Volume of moving object
If package thickness is reduced to achieve smaller size, then package density increases, but manufacturing precision requirements become more stringent
Solution Approach 1:
The dual-side mold creates a symmetric encapsulation environment where top and bottom circuits are subjected to equal pressure and alignment forces during curing. This equipotential approach to the encapsulation process reduces warpage and minimizes the need for high-precision alignment equipment, enabling thinner package designs without proportionally increasing manufacturing precision requirements
3Loss of time
If multiple separate manufacturing steps are used for encapsulation and via formation, then process control is easier, but production time and cost increase
Solution Approach 1:
The mold is pre-configured with embedded conductive elements and via structures before the encapsulation process begins. This preliminary preparation allows vias to be formed and conductive paths to be established during the same curing cycle as encapsulation, significantly reducing total manufacturing cycle time while maintaining adequate process control through standardized mold designs
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting a top integrated circuit on a first side of the substrate; mounting a bottom integrated circuit on a second side of the substrate; forming a top encapsulation over the top integrated circuit and a bottom encapsulation over the bottom integrated circuit simultaneously; and forming a bottom via through the bottom encapsulation to the substrate.