Dual-Side Molded Substrate With Through-Holes for Thin POP Packaging
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Solution Overview
Problem
The existing package-on-package (POP) structure has a high total thickness due to individually formed and stacked packages, leading to complex manufacturing processes and low units per hour production, along with electrical interconnection issues exacerbated by warpage of package substrates.
Innovation Solution
A substrate structure with dual side molding capabilities, featuring through holes that allow encapsulant to flow between mold areas on opposite surfaces, enabling a single thermal process and reducing deformation during curing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If two packages are formed individually and then stacked in a POP structure, then each package can be manufactured separately with standard processes, but the total thickness becomes large and cannot be reduced efficiently
Solution Approach 1:
The patent merges the manufacturing of two separate packages into a single integrated substrate structure. The substrate body includes first and second mold areas on opposite surfaces that are connected through through-holes, allowing both packages to be formed simultaneously in one manufacturing process rather than individually and stacked, thereby reducing total thickness while maintaining ease of manufacture.
2Adaptability or versatility
If two packages are formed individually and then stacked, then each package can be optimized independently, but the manufacturing process becomes complicated and units per hour production is low
Solution Approach 1:
The patent combines the manufacturing of two packages into a single simultaneous process using a substrate body with first and second mold areas. This integrated approach allows both packages to be formed in one operation rather than through sequential individual manufacturing and stacking, thereby increasing units per hour production while still allowing independent optimization of each package design through the mold areas.
Solution Approach 2:
The patent utilizes the third dimension by creating a substrate body with mold areas on opposite surfaces connected through through-holes. This vertical arrangement allows two packages to be formed simultaneously in different spatial zones (first mold area on first surface, second mold area on second surface) without requiring sequential processing, thereby increasing productivity while maintaining design flexibility.
3Adaptability or versatility
If packages are stacked in a POP structure, then functional integration is achieved, but electrical interconnection becomes problematic due to warpage of package substrates
Solution Approach 1:
The patent merges the two package substrates into a single integrated substrate body with through-holes connecting opposite surfaces. This integration eliminates the interface between separate substrates that causes warpage, thereby improving electrical interconnection reliability while maintaining functional integration. The through-holes provide direct electrical pathways without requiring interconnections between stacked packages.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs and complexity, increases production efficiency, and minimizes warpage, resulting in a thinner and more efficiently produced POP structure with improved electrical interconnectivity.
Implementation Method 1
the encapsulant flows through the first through hole
Data Source
AI summary
A substrate structure includes a substrate body, at least one first mold area and at least one second mold area. The substrate body has a first surface and a second surface opposite to the first surface, and defines at least one first through hole extending through the substrate body. The first mold area is disposed on the first surface of the substrate body. The second mold area is disposed on the second surface of the substrate body, wherein the first mold area is in communication with the second mold area through the first through hole.