Asymmetric Dual-Side Semiconductor Package for Lower Thermal Stress
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Solution Overview
Problem
Existing power semiconductor packages face challenges in efficiently managing thermal stress and heat dissipation due to the conventional stacked substrate configuration, which can lead to increased stress and potential damage to components.
Innovation Solution
The implementation of a semiconductor package design featuring asymmetrically coupled substrates through spacers and a lead frame, with exposed sides of the substrates, allows for improved thermal management and reduced stress on components by utilizing a dual side cooling system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional stacked substrate configuration is used, then compact structure is achieved, but thermal stress increases and heat dissipation efficiency decreases
Solution Approach 1:
The substrate is divided into multiple segments or zones with different thermal conductivities, allowing heat to be dissipated more efficiently through strategically placed high-thermal-conductivity regions while low-stress regions accommodate thermal expansion differences, thereby reducing overall thermal stress in the stacked configuration
Solution Approach 2:
The substrate structure employs asymmetric design where the bottom substrate has different thermal management characteristics compared to intermediate substrates, enabling optimized heat flow paths that reduce thermal stress accumulation while maintaining compact stacked architecture
2Temperature
If conventional stacked substrate configuration is used, then compact structure is achieved, but heat dissipation efficiency decreases
Solution Approach 1:
The patent transitions from purely vertical heat dissipation in conventional stacked substrates to multi-directional heat flow by incorporating lateral thermal pathways through the asymmetric substrate design, enabling heat to escape in multiple dimensions and improving overall heat dissipation efficiency without significantly increasing structural complexity
3Stress or pressure
If asymmetric substrate coupling is implemented, then thermal stress is reduced, but manufacturing complexity increases
Solution Approach 1:
The asymmetric substrate coupling implements local quality variations where only specific regions of the substrates have modified thermal or mechanical properties, allowing stress reduction to be achieved through targeted modifications rather than complete redesign of the entire manufacturing process, thereby limiting the increase in manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves reduced thermal stress and enhanced heat dissipation, maintaining component integrity and performance by allowing for asymmetric coupling of substrates and dual side cooling, thereby improving the reliability and efficiency of the semiconductor package.
Implementation Method 1
two or more spacers coupled to the first side of the first substrate... A lead frame between the first substrate and the second substrate
Implementation Method 2
A second side of each of the first substrate and the second substrate may be exposed through the molding compound... dual side cooling system
Implementation Method 3
Heat sinks may be coupled to an external terminal of the device... improved thermal management and reduced stress on components by utilizing a dual side cooling system
Data Source
AI summary
Implementations of semiconductor packages may include: a first substrate having two or more die coupled to a first side, a clip coupled to each of the two or more die on the first substrate and a second substrate having two or more die coupled to a first side of the second substrate. A clip may be coupled to each of the two or more die on the second substrate. The package may include two or more spacers coupled to the first side of the first substrate and a lead frame between the first substrate and the second substrate and a molding compound. A second side of each of the first substrate and the second substrate may be exposed through the molding compound. A perimeter of the first substrate and a perimeter of the second substrate may not fully overlap when coupled through the two or more spacers.