Asymmetric Dual-Side Semiconductor Package for Lower Assembly Stress
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Solution Overview
Problem
Existing semiconductor packages face challenges in reducing stress on components during assembly and manufacturing processes due to the full overlap of substrates' perimeters, which can lead to increased stress and potential damage.
Innovation Solution
The implementation of a semiconductor package design featuring asymmetric coupling of substrates through spacers, where the first and second substrates are mechanically and electrically connected via a lead frame, with spacers made of electrically conductive material to reduce stress and allow for better mold flow during encapsulation, and the use of direct bonded copper substrates with ceramic materials for thermal and electrical efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If substrates are fully overlapped during assembly, then structural stability is improved, but stress on components increases leading to potential damage
Solution Approach 1:
The patent applies asymmetric coupling where the first substrate and second substrate have perimeters that do not fully overlap when coupled through spacers. This asymmetric arrangement reduces stress concentration on components during assembly and manufacturing while maintaining structural stability through the lead frame and spacer configuration.
2Strength
If substrates are coupled through spacers with non-full overlap, then stress on components is reduced, but structural stability may be compromised
Solution Approach 1:
The patent uses a lead frame as an intermediary structure that mechanically and electrically couples the first substrate and second substrate through spacers. The lead frame acts as a mediator that distributes and manages stress while maintaining structural integrity, allowing non-full perimeter overlap without compromising stability.
3Ease of manufacture
If traditional substrate coupling is used, then manufacturing simplicity is maintained, but mold flow during encapsulation is restricted
Solution Approach 1:
The patent segments the substrate coupling structure by using discrete spacers at specific locations rather than full perimeter coupling. This segmentation allows mold flow to access and encapsulate the second sides of substrates more effectively, improving encapsulation efficiency while maintaining manufacturing simplicity through standardized spacer placement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces stress on components during assembly and manufacturing, enhances thermal and electrical performance, and improves the encapsulation process by allowing for better mold flow and exposure of substrates' sides for heat dissipation.
Implementation Method 1
direct bonded copper substrates with ceramic materials for thermal and electrical efficiency
Implementation Method 2
two or more spacers made of electrically conductive material to reduce stress and allow for better mold flow during encapsulation
Data Source
AI summary
Implementations of semiconductor packages may include: a first substrate having two or more die coupled to a first side, a clip coupled to each of the two or more die on the first substrate and a second substrate having two or more die coupled to a first side of the second substrate. A clip may be coupled to each of the two or more die on the second substrate. The package may include two or more spacers coupled to the first side of the first substrate and a lead frame between the first substrate and the second substrate and a molding compound. A second side of each of the first substrate and the second substrate may be exposed through the molding compound. A perimeter of the first substrate and a perimeter of the second substrate may not fully overlap when coupled through the two or more spacers.