Dual-Side RF Module Isolating PA and LNA
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Solution Overview
Problem
Conventional radio-frequency modules with circuit elements on a single-side mounted substrate suffer from degraded isolation characteristics between transmission and reception paths due to strong RF interference, as the low noise amplifier and power amplifier are arranged on the same mounting face, leading to increased size and reduced density.
Innovation Solution
A radio-frequency module with a dual-side mounted substrate configuration, where the power amplifier and low noise amplifier are mounted on opposite faces, along with an antenna switch and impedance matching circuit, to enhance isolation and reduce size by separating these components and using through electrodes for improved heat radiation and connection efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the low noise amplifier and power amplifier are arranged on the same mounting face to increase density, then the module size is reduced, but strong RF interference occurs between transmission and reception signals degrading isolation characteristics
Solution Approach 1:
The mounting substrate is divided into two separate mounting faces, with transmission system components (power amplifier) mounted on one face and reception system components (low noise amplifier) mounted on the other face. This spatial segmentation physically separates the transmission and reception signal paths, eliminating RF interference while maintaining high density through efficient use of both substrate faces.
Solution Approach 2:
The arrangement transitions from a two-dimensional planar layout on a single face to a three-dimensional utilization of both faces of the mounting substrate. By mounting components on opposite faces, the design adds the vertical dimension (through-substrate connections) to achieve signal path separation without increasing the horizontal footprint, thus reducing module size while improving isolation.
2Productivity
If circuit elements are mounted on both faces of the mounting substrate to increase density, then the module becomes more compact, but isolation characteristics between transmission and reception paths are degraded due to RF interference
Solution Approach 1:
The dual-face mounting configuration segments transmission and reception components onto separate faces, allowing high density through comprehensive substrate utilization while maintaining signal path isolation. This segmentation strategy enables both high productivity (density) and high reliability (isolation) simultaneously.
3Volume of moving object
If the transmission power amplifier and antenna switch are arranged on the same mounting face, then the module size is reduced, but interference between transmission signal and reception signal increases
Solution Approach 1:
The power amplifier and antenna switch are segmented and mounted on opposite faces of the mounting substrate, physically separating the transmission signal path from the reception signal path. This eliminates the harmful interference generated by the transmission signal while maintaining compact module dimensions through efficient dual-face utilization.
Data Source
AI summary
A radio-frequency module is capable of being connected to an external substrate and includes a mounting substrate having a main face and a main face, which are opposed to each other, multiple ground terminals with which the mounting substrate is electrically connected to the external substrate, a PA mounted on the main face, and an LNA mounted on the main face. A communication apparatus includes the radio-frequency module.