Sandwich Heat Receiver with Segmented Plates

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Solution Overview

Problem

Conventional cooling devices for heat-generating bodies, such as semiconductor elements, are inefficient in transferring heat from the heat source to the coolant, particularly due to limitations in thermal conductivity and heat transfer pathways.

Innovation Solution

A heat-receiver design featuring a first plate portion that receives heat from a heat-generating body, a second plate portion with greater thickness, and a heat-transfer member that couples these plates with wider flow paths for coolant passage, enhancing thermal conductivity and heat transfer efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a conventional single-plate heat sink is used, then the structure is simple, but the heat transfer efficiency is insufficient

Engineering Contradiction:
Improveheat transfer efficiencyVSAvoidstructure complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The heat receiver is divided into a first plate portion and a second plate portion that are coupled together to form a sandwich structure. This segmentation allows heat to be transferred from both sides of the first plate portion to the coolant, effectively doubling the heat transfer pathways compared to a conventional single-plate design.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention transitions from a single-plane heat transfer approach to a three-dimensional sandwich structure with heat transfer occurring on both sides of the first plate portion. This dimensional change enables simultaneous heat dissipation from multiple surfaces, significantly improving heat transfer efficiency.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Quantity of substance

If the plate thickness is increased to improve thermal capacity, then the thermal capacity increases, but the coolant flow passage becomes restricted

Engineering Contradiction:
Improvethermal capacityVSAvoidcoolant flow passage clearance
Core Design Contradiction:
Quantity of substanceVSManufacturing precision

Solution Approach 1:

The thermal mass is segmented into two separate plate portions (first and second plates) with different thicknesses. The first plate portion has greater thickness to provide thermal capacity, while the second plate portion is thinner to maintain adequate coolant flow passages, resolving the conflict between thermal capacity and flow clearance.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the heat receiver have different plate thicknesses optimized for their specific functions. The first plate portion has greater thickness for thermal capacity where heat is received, while the second plate portion has reduced thickness to ensure sufficient coolant flow passages, achieving local optimization of both requirements.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design improves cooling efficiency by allowing heat to be transferred not only from the lower side but also from the upper side, increasing the thermal capacity and enhancing the overall cooling performance compared to conventional designs.

Implementation Method 1

a first plate portion (32) that receives heat at one face from a heat generating body

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a second coupling portion (38) that couples together the first plate portion (32) and the second plate portion (34)... with a gap between the second coupling portion (38) and the first coupling portion (36) through which a coolant is capable of passing

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9661780B2Heat-receiver, cooling unit and electronic device
Publication Date: 2017.05.23 FUJITSU LTD
  • US9661780B2 patent drawing
  • US9661780B2 patent drawing
  • US9661780B2 patent drawing

AI summary

A heat-receiver includes: a first plate that receives heat at one face from a heat generating body; a second plate that is disposed facing another face of the first plate with a spacing therebetween, and that has a greater plate thickness than a plate thickness of the first plate; a first coupling portion that couples together the first plate and the second plate; and a second coupling portion that couples together the first plate and the second plate at a position that faces across the first plate toward the heat generating body, with a gap between the second coupling portion and the first coupling portion through which a coolant is capable of passing, and that has a width along the other face of the first plate that is greater than a width of the first coupling portion, as viewed along the coolant passing direction.