Dual-Sided Antenna Package Layout for Compact Multi-Band Integration
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Solution Overview
Problem
The increasing demand for electronic functionality in semiconductor device packages leads to larger size and form factors, which can be limiting in portable devices.
Innovation Solution
A semiconductor device design that incorporates a carrier with two antennas, one on each side, operating at different frequencies, allowing for increased functionality without increasing the size or form factor. The antennas are arranged such that a higher-band antenna is positioned on one side of the carrier, and a lower-band antenna is on the other side, with the antenna module and connector strategically placed to minimize size and maximize functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple antennas with different frequencies are integrated into the semiconductor device, then electronic functionality is enhanced, but the size and form factor of the device package increase
Solution Approach 1:
The patent utilizes the third dimension (vertical stacking) to accommodate multiple antennas of different frequencies within a compact footprint. By positioning antennas at different heights and orientations above the substrate, the design achieves multi-frequency functionality without increasing the planar area of the device package, thus resolving the contradiction between enhanced adaptability and minimized volume.
2Volume of moving object
If antenna module and connector are strategically placed to minimize size, then device compactness is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent divides the antenna system into separate modular components, each designed to operate at specific frequencies with distinct geometric configurations. This segmentation allows each antenna module to be independently optimized and manufactured, then assembled onto the substrate in a structured manner, reducing overall manufacturing complexity while achieving compact multi-frequency integration.
Data Source
AI summary
The present disclosure provides a semiconductor device. The semiconductor device includes a carrier having a first side and a second side adjacent to the first side. The semiconductor device also includes a first antenna adjacent to the first side and configured to operate at a first frequency and a second antenna adjacent to the second side and configured to operate at a second frequency different from the first frequency. An method of manufacturing a semiconductor device is also provided.