Dual-Sided Camera Module for 360-Degree Panoramic Imaging
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Solution Overview
Problem
Conventional camera modules with multiple lenses for panoramic imaging are bulky, heavy, and difficult to miniaturize, limiting their portability and image display capabilities, as they require combining image data from multiple lenses to achieve 360-degree panoramic views.
Innovation Solution
A camera module with two extra-wide-angle lenses and image processing chips, integrated onto a multilayer circuit substrate, allowing for 360-degree panoramic imaging in a compact form factor, with the lenses and chips arranged in sequence and electrically connected to the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple independent lenses are assembled to achieve 360-degree panoramic imaging, then panoramic photographing capability is improved, but the device volume and weight increase
Solution Approach 1:
The patent merges multiple photographing members and their corresponding circuit substrates into a single integrated circuit substrate. The first and second photographing members are mounted on opposite sides of the same substrate, eliminating the need for separate assemblies. This integration maintains 360-degree panoramic imaging capability while significantly reducing overall device volume.
Solution Approach 2:
The patent transitions from a planar arrangement of multiple independent lenses to a three-dimensional integrated structure where photographing members are positioned on opposite sides of a multilayer circuit substrate. This spatial reorganization in multiple dimensions enables compact packaging while preserving the panoramic imaging function.
2Adaptability or versatility
If multiple independent lenses and camera elements are assembled separately before combination, then panoramic imaging function is achieved, but the device becomes bulky and heavy
Solution Approach 1:
The patent combines multiple camera elements (lenses, filters, image processing chips) and their supporting structures into a single integrated circuit substrate assembly. The first and second photographing members with their respective elements are mounted on the same substrate, reducing the number of separate components and thereby decreasing overall device weight.
3Adaptability or versatility
If conventional multilayer circuit substrates are used with multiple photographing members, then panoramic imaging is enabled, but manufacturing complexity increases
Solution Approach 1:
The patent divides the integrated circuit substrate into distinct functional regions: a first lateral side for the first photographing member and an opposite second lateral side for the second photographing member. This segmentation allows independent mounting and testing of each photographing member while maintaining overall integration, thereby reducing manufacturing complexity.
Solution Approach 2:
The multilayer circuit substrate serves multiple functions simultaneously: it provides mechanical support for both photographing members, establishes electrical connections between all camera elements and external interfaces, and enables panoramic imaging capability. This multi-functionality reduces the need for additional separate components and simplifies the overall manufacturing process.
Data Source
AI summary
A camera module includes a first and a second photographing member, and a circuit substrate. The circuit substrate has a first lateral side and an opposite second lateral side, and a plurality of circuits. The first and the second photographing member is provided on the first and the second lateral side of the circuit substrate respectively and electrically connected to the circuit substrate. With these arrangements, the camera module can have overall reduced volume and is able to photographing a 360-degree panoramic image and lower the manufacturing cost.