Dual-Sided Shower Cooling for High-Power Semiconductor Chips
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Solution Overview
Problem
Existing cooling systems for semiconductor devices are inadequate in handling the increased power density and heat generation of high-performance computing and stacked semiconductor chips, necessitating more efficient cooling solutions.
Innovation Solution
A semiconductor device with a multiple side shower cooling structure that supplies cooling liquid onto two surfaces of the semiconductor chip using a stacked configuration of first and second shower blocks, each with nozzles and outlets to facilitate impingement jet cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If air cooling devices are used, then device simplicity is maintained, but cooling efficiency is insufficient for high power density
Solution Approach 1:
The patent transitions from air cooling to liquid cooling by introducing a cooling liquid circulation system with nozzles, channels, and outlets. The liquid cooling structure directly contacts the semiconductor chip surfaces, enabling efficient heat removal through hydraulic flow patterns that adapt to high power density requirements while maintaining structural integration.
Solution Approach 2:
The patent implements dual-sided cooling by providing nozzles and outlets on both the top and bottom surfaces of the semiconductor chip. This dimensional approach allows simultaneous cooling of both chip surfaces, dramatically increasing the effective cooling area and heat dissipation capacity compared to single-sided or air cooling methods.
2Loss of energy
If liquid cooling devices are used, then cooling efficiency is improved, but device complexity increases
Solution Approach 1:
The patent integrates the cooling liquid supply and discharge functions into a unified structure where inlet channels and outlet channels are embedded within the same cooling apparatus. The nozzles and outlets are positioned in coordinated arrays on both chip surfaces, merging multiple cooling functions into a single integrated system that reduces overall device complexity.
Solution Approach 2:
The cooling liquid serves multiple functions simultaneously: it cools the top surface through top nozzles, cools the bottom surface through bottom nozzles, and the circulated liquid absorbs heat from both surfaces. This multi-functional liquid cooling system replaces what would otherwise require separate cooling mechanisms for each surface.
3Device complexity
If single-phase liquid cooling is used, then system simplicity is maintained, but heat processing range is limited
Solution Approach 1:
The patent employs two-phase liquid cooling where the cooling liquid undergoes phase change from liquid to vapor and back. The cooling liquid is supplied as liquid through nozzles, absorbs heat from the semiconductor chip, vaporizes during the phase transition process, and then condenses back to liquid form. This phase transition mechanism enables the system to process a wider range of heat loads and temperatures compared to single-phase cooling, while the circulated cooling liquid maintains system operational simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances cooling efficiency by directly cooling both surfaces of the semiconductor chip, maintaining stable temperature ranges, and is applicable to electronic devices with high power density and heat generation.
Implementation Method 1
a plurality of first nozzles configured to spray a cooling liquid into the cavity toward a top surface of the at least one semiconductor chip; and a plurality of second nozzles configured to spray the cooling liquid into the cavity toward a bottom surface of the at least one semiconductor chip
Implementation Method 2
Two-phase liquid cooling methods are used to process heat in a wider range than single-phase liquid cooling methods
Data Source
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AI summary
A semiconductor device includes a semiconductor chip including a semiconductor integrated circuit; a cooling block including a first shower block and a second shower block stacked on the first shower block such that the first shower block and the second shower block define a cavity in which the at least one semiconductor chip is accommodated; and a printed circuit board, wherein the at least one cooling block is on the printed circuit board. The first shower block includes: first nozzles configured to spray a cooling liquid into the cavity toward a top surface of the semiconductor chip; and first outlets that receive the cooling liquid from the cavity, and the second shower block includes: second nozzles configured to spray the cooling liquid into the cavity toward a bottom surface of the semiconductor chip; and second outlets that receive the cooling liquid from the cavity.