Dual-Sided Multi-Beam Chip Module for Compact Phased Array Layout
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Solution Overview
Problem
Existing multi-beam phased array antennas face challenges in miniaturization and integration, especially at higher frequency bands, due to the complexity of wiring and layout constraints imposed by the reduced size of antenna array units.
Innovation Solution
A multi-beam chip integration module is designed with a first printed board where multi-beam channel chips are surface mounted on one side and multi-beam synthesis network chips on the opposite side, reducing the board size required for chip layout and simplifying wiring complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If all chips are surface mounted on one side of the printed board, then the wiring layout is simpler, but the board size becomes too large for miniaturization
Solution Approach 1:
The patent applies dimensionality change by utilizing both sides of the printed board for chip mounting. Specifically, first-type chips are surface mounted on the first side while second-type chips are surface mounted on the second side, effectively transitioning from a single-plane to a dual-plane configuration. This resolves the contradiction by maintaining wiring simplicity through localized connections while achieving board miniaturization through spatial distribution across two dimensions.
2Area of stationary object
If the antenna array units are reduced in size for miniaturization, then the overall antenna size decreases, but the wiring complexity increases
Solution Approach 1:
The patent applies segmentation by dividing chips into two functional categories: first-type chips (signal processing) and second-type chips (control and power management). These segmented chip groups are strategically positioned on different sides of the board, with their respective wiring routes optimized independently. This segmentation allows the wiring complexity to be managed through modular routing while maintaining compact antenna array unit sizes.
3Adaptability or versatility
If multi-beam technology is adopted to improve user capacity and coverage, then the system performance improves, but the integration difficulty increases
Solution Approach 1:
The patent applies merging by integrating multiple functional components into a unified dual-sided module. First-type chips handling signal processing and second-type chips handling control functions are combined on a single printed board, with their interconnections established through defined wiring patterns. This merged configuration enables multi-beam functionality while managing integration complexity through systematic component arrangement and routing.
Data Source
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AI summary
The present disclosure provide a multi-beam chip integration module and a phased array system, wherein the multi-beam chip integration module comprises a first printing board, at least one set of first-type chips, and at least one set of second-type chips, the at least one set of first-type chips surface mounted to a first side of the first printing board, and the at least one set of second-type chips surface mounted to a second side of the first printing board, and wherein the second side of the first printing board is an opposite side parallel to the first side of the first printing board. Where the number and size (specification) of the first-type chips and the second-type chips do not change, surface mounting the first-type chips and the second-type chips to two sides of the first printing board requires a smaller area, i.e., a smaller size, of the first printing board as compared to surface mounting the same to one side of the first printing board. Therefore, the chip layout following the reduced size of the printed board can be satisfied, the wiring complexity of the antenna network can be reduced, and the chip layout can be completed in a simple and rapid manner.