Dual-Sided Liquid Cooling Plates for Edge Computing Processors
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Solution Overview
Problem
Current cooling solutions for high power density chips and edge computing hardware face challenges in thermal management due to varying form factors and environments, requiring customized and robust thermal designs that are difficult to standardize.
Innovation Solution
A cooling device design featuring dual liquid cooling plates with integrated distribution channels and thermal pads for improved heat transfer, along with a flexible mounting mechanism to ensure effective thermal contact and pressure distribution, suitable for heterogeneous packaging and edge computing applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If customized cooling devices are designed for each processor with varying form factors and mounting methods, then thermal management effectiveness is improved, but device complexity and design difficulty increase significantly
Solution Approach 1:
The cooling device is designed with a universal mounting mechanism that can accommodate multiple processor form factors and mounting methods through a single standardized interface design, eliminating the need for customized cooling devices for each processor type while maintaining thermal management effectiveness
2Ease of manufacture
If standardized cooling device design is implemented to simplify design process, then ease of manufacture and design are improved, but adaptability to different processor form factors and mounting methods deteriorates
Solution Approach 1:
The mounting mechanism incorporates adjustable and configurable components that can be dynamically adapted to different processor form factors and mounting requirements, allowing a standardized cooling device design to maintain versatility across various applications without requiring customization
3Loss of energy
If liquid cooling solution is implemented for heterogeneous packaging with high power density, then heat removal efficiency is improved, but system complexity and design challenges increase
Solution Approach 1:
The cooling device is divided into modular components including a cooling plate with distribution channels, thermal pads, and mounting mechanisms that can be independently designed and assembled, simplifying the overall system complexity while maintaining high heat removal efficiency through liquid cooling
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides efficient heat removal and improved thermal performance across diverse hardware configurations, enhancing reliability and performance while simplifying design complexity.
Implementation Method 1
extract heat from the top surface of the processor using cooling liquid flowing through the first liquid distribution channel
Implementation Method 2
cooling liquid flowing through the first liquid distribution channel
Implementation Method 3
thermal pads for improved heat transfer
Data Source
AI summary
In one embodiment, a cooling device for providing liquid cooling to a processor or a computing hardware/system includes a first cooling plate having a first liquid distribution channel integrated therein. The first cooling plate is to be positioned on a top surface of a processor to extract heat from the top surface of the processor using cooling liquid flowing through the first liquid distribution channel. The cooling device further includes a second cooling plate having a second liquid distribution channel integrated therein. The second cooling plate is to be positioned at a bottom surface of the processor to extract heat from the bottom surface of the processor using cooling liquid flowing through the second liquid distribution channel. The cooling device further includes a mounting mechanism to mount the first and second cooling plates onto top and bottom of the processor to sandwich the process in between with good thermal contact.