Dual-Sided DC/DC Converter Layout for Compact Cooling
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Solution Overview
Problem
Conventional DC/DC converters occupy large areas on printed circuit boards due to the mounting of inductors and power modules on the same surface, leading to increased costs and impaired cooling efficiency, as the heat sink's shape is restricted by other components.
Innovation Solution
The power source device mounts at least one power module on a sub-mounting surface opposite to the main mounting surface, allowing for extra space and improved heat dissipation, with the heat sink shared by all power modules and mounted in contact with their upper surfaces, and alternating the mounting of power modules between the main and sub-mounting surfaces to enhance thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If all power modules and inductors are mounted on the same main mounting surface, then the electrical connectivity and functionality are simplified, but the area occupied by the DC/DC converter increases and cooling efficiency deteriorates
Solution Approach 1:
The patent applies dimensionality change by mounting power modules on both the main mounting surface and the sub-mounting surface of the printed circuit board. This utilizes the third dimension (vertical stacking) to reduce the footprint area while maintaining all necessary electrical connections through via holes that penetrate through the board layers.
Solution Approach 2:
The patent segments the mounting locations of power modules across two different surfaces (main and sub-mounting surfaces). This segmentation allows inductors to be positioned only on the main surface while power modules are distributed on both surfaces, optimizing both area utilization and thermal management.
2Device complexity
If all power modules and inductors are mounted on the same main mounting surface, then the layout is simplified, but the heat sink design is restricted and cooling efficiency deteriorates
Solution Approach 1:
By distributing power modules across two surfaces, the patent creates vertical space for heat sink placement without being constrained by lateral component arrangements. The heat sink can be mounted on the sub-mounting surface directly contacting power modules, enabling effective thermal management.
Solution Approach 2:
The sub-mounting surface acts as an intermediary space that facilitates heat sink placement. This intermediate layer allows thermal management components to be positioned optimally without interfering with the main circuit layout on the opposite surface.
3Temperature
If the area occupied by the DC/DC converter is increased to improve cooling, then the printed circuit board area increases and cost increases, but cooling efficiency improves
Solution Approach 1:
The patent resolves this contradiction by utilizing the vertical dimension through dual-surface mounting. This allows compact lateral arrangement of components while providing adequate space for heat sinks on the sub-mounting surface, achieving effective cooling without increasing the printed circuit board footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the overall area occupied by the DC/DC converter, improves cooling efficiency, and decreases costs by allowing for a simpler and more effective heat sink design, while maintaining electrical connectivity and functionality.
Implementation Method 1
the heat sink shared by all power modules and mounted in contact with their upper surfaces
Implementation Method 2
improved cooling efficiency
Data Source
AI summary
A DC/DC converter includes N inductors and N power modules which correspond to N phases. At least one of the N power modules is mounted on a sub-mounting surface that is opposite to a main mounting surface of a printed circuit board.