Dual-Sided Electrode Component for Thin Electronic Devices
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Solution Overview
Problem
Modern electronic devices, such as smartphones and tablets, face challenges in minimizing layer thickness due to the presence of emitters and sensors, which restricts their overall height, and existing methods for producing components are not economical or efficient in achieving a compact and mechanically stable design.
Innovation Solution
A component design featuring a first and second part, with a housing body enclosing a continuous electrode on both sides, allowing parts like optoelectronic semiconductor chips and sensors to be mounted on both sides of the electrode, reducing overall height and using a molding method to form the housing body around the electrode, ensuring regions of the electrode remain uncovered for mounting surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a conventional single-sided mounting structure is used, then the component structure is simple, but the overall height cannot be reduced sufficiently
Solution Approach 1:
The patent transitions from single-sided mounting to dual-sided mounting of electrical parts on the electrode, utilizing both sides of the electrode for component placement. This dimensional change in the mounting arrangement allows significant reduction in overall component height while maintaining structural simplicity through the housing body that encloses the electrode on both sides.
2Stability of the object's composition
If the housing body fully covers the electrode, then mechanical stability is improved, but mounting surfaces are not available
Solution Approach 1:
The housing body is designed with differentiated local properties: it encloses the electrode laterally to provide mechanical stability, but deliberately leaves the front and rear sides of the electrode uncovered in specific regions. This local quality differentiation allows the electrode to serve dual purposes - structural stability from enclosure and electrical connection function from exposed surfaces - resolving the contradiction between stability and manufacturability.
3Adaptability or versatility
If multiple emitters and sensors are added to different sides, then device functionality is improved, but layer thickness increases
Solution Approach 1:
The patent enables placement of electrical parts (emitters and sensors) on both the front and rear sides of the electrode, effectively utilizing three-dimensional space within the housing body. This dual-sided arrangement allows multiple functional components to be integrated without increasing the overall layer thickness, as components are stacked vertically rather than arranged horizontally.
Data Source
AI summary
The invention relates to a component comprising a first part, a second part, a housing body, and a first electrode, wherein the housing body encloses the first electrode in lateral directions at least in some regions. The first electrode has a front face and a rear face facing away from the front face, and the front and rear faces are free of a cover produced by a material of the housing body at least in some regions. The first part is arranged on the front face, and the second part is arranged on the rear face, and both the first and second parts are connected to the first electrode in an electrically conductive manner. The first electrode is designed to be continuous and is arranged between the first part and the second part in the vertical direction. Also described is a method for producing the component.