Dual-Sided Heat Dissipation Mechanism for Compact Electronic Chassis
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Solution Overview
Problem
In electronic apparatuses like laptops, the large size of cooling devices can occupy valuable space, affecting the installation of other components, necessitating a solution to optimize space usage within the chassis.
Innovation Solution
The implementation of a dual heat dissipation mechanism involving a heat transfer member with expansion portions and blower mechanisms that cool both main surfaces of the heat transfer member, utilizing first and second cooling devices with heat dissipation plates and blower mechanisms to efficiently dissipate heat from the CPU, thereby reducing the overall installation area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional cooling device is used, then heat dissipation function is provided, but the device occupies large space in the chassis
Solution Approach 1:
The patent transitions from single-sided heat dissipation to dual-sided heat dissipation by adding cooling functionality to both the upper and lower surfaces of the heat transfer member. This dimensional expansion allows heat to be dissipated from two directions simultaneously, effectively doubling the heat dissipation area without proportionally increasing the footprint space in the chassis, thereby resolving the contradiction between heat dissipation capability and installation space occupation.
2Area of stationary object
If the cooling device size is reduced to save space, then chassis space is optimized, but heat dissipation efficiency may be compromised
Solution Approach 1:
By implementing cooling on both the upper and lower surfaces of the heat transfer member, the patent effectively doubles the heat dissipation surface area within the same footprint. This allows the cooling device to maintain or even improve heat dissipation efficiency while occupying the same or reduced space in the chassis, thus resolving the contradiction between space utilization and heat dissipation efficiency.
Solution Approach 2:
The cooling device is segmented into multiple independent cooling units: an upper cooling unit with first blowing unit and first heat dissipation plate, and a lower cooling unit with second blowing unit and second heat dissipation plate. This segmentation allows each unit to operate independently and efficiently, maximizing heat dissipation from both surfaces while maintaining a compact overall structure that optimizes chassis space utilization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for efficient cooling of both surfaces of the heat transfer member, reducing the space required for the heat dissipation mechanism and optimizing the use of chassis space, ensuring effective heat management while minimizing the installation area.
Implementation Method 1
a first blower mechanism configured to blow a gas to come into contact with the first heat dissipation plate, and a second blower mechanism configured to blow a gas to come into contact with the second heat dissipation plate
Implementation Method 2
the first blower mechanism brings the gas into contact with the first heat dissipation plate by blowing the gas in a direction facing the first heat dissipation plate, and the second blower mechanism brings the gas into contact with the second heat dissipation plate by blowing the gas in a direction facing the second heat dissipation plate
Implementation Method 3
a heat transfer member in contact with the heat generation element in a heat-transferable manner; the first heat dissipation plate in contact with the first main surface in a heat-transferable manner, and the second heat dissipation plate in contact with the second main surface in a heat-transferable manner
Data Source
AI summary
An electronic apparatus includes: a chassis; a heat generation element provided in the chassis; a heat transfer member in contact with the heat generation element in a heat-transferable manner; and one or a plurality of heat dissipation mechanisms configured to cool the heat transfer member. The heat dissipation mechanism includes a first cooling device configured to cool a first main surface of the heat transfer member, and a second cooling device configured to cool a second main surface of the heat transfer member opposite to the first main surface. The first cooling device includes a first heat dissipation plate in contact with the first main surface in a heat-transferable manner, and a first blower mechanism configured to blow a gas to come into contact with the first heat dissipation plate.