Dual-Sided Interconnect Flex Circuit for HAMR Systems
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increasing demand for higher data storage density in heat-assisted magnetic recording systems requires more traces and bond pads on flex circuits, which poses challenges in maintaining the form factor and increasing interconnect connections effectively.
Innovation Solution
A dual-sided interconnect flex circuit structure with obverse and reverse side bond pads and traces, where slider and HAMR traces are formed on the obverse side and connected through conductive paths on the reverse side, allowing for increased interconnects without expanding the form factor dimensions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If more traces and bond pads are added to flex circuits to support higher recording density in HAMR systems, then the interconnect capability is improved, but the form factor dimensions increase
Solution Approach 1:
The patent applies dimensionality change by utilizing both the top surface and bottom surface of the flex circuit substrate for bonding connections. Instead of expanding the footprint area, the invention uses the third dimension (through-substrate vias) to create interconnections on both faces of the circuit, effectively doubling the available bonding area without increasing the form factor dimensions.
Solution Approach 2:
The patent implements nesting by placing through-substrate vias within the substrate thickness, allowing conductive paths to be embedded within the flex circuit structure itself. This nested approach enables multiple interconnect layers to be contained within the same footprint area, increasing trace and bond pad quantity without expanding the external dimensions.
2Adaptability or versatility
If the number of interconnect connections is increased to support more transducer elements and HAMR units, then the functionality is improved, but the device complexity increases
Solution Approach 1:
The patent applies multi-functionality by designing the through-substrate vias to serve dual purposes: providing mechanical support for the flex circuit while simultaneously serving as conductive interconnect paths. This universal design allows the same structural element to fulfill multiple functions, reducing overall device complexity while increasing interconnect capability.
Solution Approach 2:
The patent merges the substrate structure with the interconnect function by integrating through-substrate vias that combine mechanical support and electrical conduction into a single unified structure. This merging eliminates the need for separate support and interconnect elements, simplifying the overall device architecture while enabling increased interconnect connections.
Data Source
AI summary
A flex circuit including a dual sided interconnect structure to connect electrical components on a head or suspension assembly to head circuitry is described. The dual sided interconnect structure described has application for providing an electrical connection to one or more transducer elements on a slider and one or more elements of a heat assisted magnetic recording HAMR unit. In an illustrated embodiment, a flexible structure or insulating base layer includes one or more slider and heat assisted magnetic recording traces coupled to one or more slider or HAMR bond pads on an interconnect portion. As disclosed, the slider bond pads are on the obverse side of the flexible structure and the HAMR bond pads include a reverse side bonding surface to form reverse side bond pads to connect to one or more electrical or heating elements on the HAMR unit.