Dual-Sided IPD Packaging With Through-Vias for Reliable Interconnection
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Solution Overview
Problem
Current methods for integrating Intelligent Power Devices (IPDs) in package systems face challenges in efficient electrical interconnection and reliable bonding between package components, leading to potential issues with signal transmission and package reliability.
Innovation Solution
The integration of IPDs with through-vias penetrating through semiconductor substrates, allowing for dual-sided electrical interconnection between package components, and the use of solder regions and underfills to ensure robust bonding and connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If IPDs are bonded to interposers with traditional single-sided interconnection methods, then the bonding process is simpler, but the electrical interconnection efficiency and signal transmission reliability are reduced
Solution Approach 1:
The patent transitions from traditional single-sided electrical interconnection to dual-sided through-via interconnection, adding a vertical dimension to the electrical connection path. Through-vias penetrate the entire IPD thickness, enabling electrical signals to traverse from one substrate to another through the IPD, thereby improving interconnection reliability and signal transmission efficiency while managing the increased structural complexity.
Solution Approach 2:
The IPD structure is segmented into multiple functional layers including first substrate, second substrate, and through-vias, with each layer serving specific electrical interconnection functions. This segmentation allows independent optimization of each component while maintaining overall system reliability, addressing the complexity through modular design.
2Productivity
If through-vias are used for dual-sided electrical interconnection, then the electrical connectivity and signal transmission are improved, but the manufacturing process becomes more complex
Solution Approach 1:
The patent incorporates through-vias during the IPD fabrication process itself, rather than adding them as a separate post-processing step. This preliminary action integrates the via formation into the existing manufacturing flow, reducing the need for additional complex assembly steps and improving signal transmission efficiency without proportionally increasing manufacturing complexity.
3Reliability
If traditional bonding methods are used without underfills, then the manufacturing process is simpler, but the package reliability and bonding robustness are reduced
Solution Approach 1:
The patent introduces underfill material as an intermediary substance between the IPD and substrates. This underfill serves multiple functions: mechanical support, stress distribution, and thermal management, thereby enhancing package bonding reliability and robustness while the added structural complexity is managed through its integrative role in the existing package architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the electrical connectivity and reliability of package systems by maintaining the count of solder regions and allowing for flexible design, improving the overall reliability and efficiency of signal transmission between components.
Implementation Method 1
The IPD electrically interconnects the first and the second package components through through-vias
Implementation Method 2
bonding a second package component to the first package component through a first plurality of solder regions
Implementation Method 3
the use of solder regions and underfills to ensure robust bonding and connectivity
Data Source
AI summary
A method includes forming a first package component, which includes an interposer, and a first die bonded to a first side of the interposer. A second die is bonded to a second side of the interposer. The second die includes a substrate, and a through-via penetrating through the substrate. The method further includes bonding a second package component to the first package component through a first plurality of solder regions. The first package component is further electrically connected to the second package component through the through-via in the second die. The second die is further bonded to the second package component through a second plurality of solder regions.