Dual-Sided Light Source Device Thermal Dissipation
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Solution Overview
Problem
Conventional light source devices with semiconductor laser elements face challenges in efficiently dissipating heat, particularly when using high-power elements like nitride semiconductor lasers, due to limited thermal dissipation performance and small thermal dissipation areas.
Innovation Solution
A light source device configuration featuring a flat plate base with semiconductor light-emitting elements thermally connected to it, and a dual fixing component system with through-holes and threaded engagement to enhance thermal conductivity and adhesion, allowing efficient heat dissipation through both main surfaces of the base.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high-power semiconductor laser elements are used, then light output power is improved, but heat generation increases and thermal dissipation becomes insufficient
Solution Approach 1:
The patent transitions from single-sided heat dissipation to dual-sided heat dissipation by adding a second fixing component on the opposite side of the base. Heat can now escape through both main surfaces of the base plate, effectively doubling the thermal dissipation area and reducing temperature increase of the laser element.
Solution Approach 2:
The patent divides the heat dissipation function into two separate fixing components located on opposite sides of the base. Each fixing component independently contributes to thermal management, allowing heat to be dissipated through multiple parallel paths rather than a single concentrated path.
2Device complexity
If conventional single-sided fixing is used, then device structure is simple, but thermal dissipation area is limited
Solution Approach 1:
The patent adds spatial dimension to heat dissipation by utilizing both faces of the base plate. Instead of concentrating all fixing and heat dissipation functions on one side, the solution distributes them across two opposing sides, effectively increasing the thermal dissipation area without proportionally increasing overall device volume.
3Temperature
If base thickness is increased to improve thermal dissipation, then heat dissipation capacity is improved, but device size increases
Solution Approach 1:
The patent resolves the conflict between heat dissipation capacity and device size by utilizing the planar dimensions (both faces) rather than increasing the thickness dimension. Dual-sided heat dissipation allows efficient thermal management while maintaining a compact overall device profile.
Solution Approach 2:
The heat dissipation function is segmented into two independent paths through the two main surfaces of the base. This segmentation allows heat to be dissipated through multiple parallel thermal pathways, increasing total heat dissipation capacity without requiring any single pathway (including base thickness) to be excessively large.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces thermal resistance and enhances heat dissipation capabilities, effectively managing temperature increases in high-power semiconductor laser elements.
Implementation Method 1
a semiconductor light-emitting element that emits light when electric power is supplied
Implementation Method 2
heat generated by semiconductor laser element 1011 is transferred through a thermal dissipation path formed by submount 1012, element fixing block 1013, and base 1014
Data Source
AI summary
A light source device includes: a semiconductor light-emitting device including a flat-shaped base having a first main surface on a first side and a second main surface and a semiconductor light-emitting element disposed on the first side; a first fixing component having a first through-hole and a first pressing surface that presses the first main surface; and a second fixing component having a second through-hole and a second pressing surface that presses the second main surface. The base is fixed between the first and second pressing surfaces by an engagement between a first inner surface surrounding the first through-hole of the first fixing component and a second outer surface of the second fixing component. A distance between the first and second pressing surfaces is smaller than or equal to a thickness of the base, and a void is formed lateral to the base between the first and second pressing surfaces.