Dual-Sided Liquid Cooling Assembly for PCB Thermal Tolerance
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Solution Overview
Problem
Traditional cooling methods struggle to efficiently manage thermal loads on both sides of a PCB with varying power densities and mechanical tolerances, leading to uneven cooling and design complexity, especially in high-performance computing systems with vertical power delivery technology.
Innovation Solution
A dual-sided liquid cooling assembly with flexible heat sinks and adjustable coolant pathways, allowing simultaneous thermal management on both sides of the PCB, accommodating varying thermal loads and mechanical tolerances, while maintaining compactness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a single rigid cooling element is used, then manufacturing is simplified, but thermal management effectiveness deteriorates due to mechanical tolerances and misalignment between components
Solution Approach 1:
The cooling system is divided into multiple independent heat sinks rather than using a single rigid cooling element. Each heat sink can be independently positioned and adjusted to contact specific heat-dissipating areas, accommodating mechanical tolerances and misalignments while maintaining effective thermal contact.
Solution Approach 2:
The heat sinks are designed with adjustable and movable characteristics, allowing them to be positioned optimally relative to the electronic components. This dynamic adjustment capability compensates for mechanical tolerances and ensures reliable thermal contact despite variations in component positioning.
2Device complexity
If traditional air cooling methods are used, then system complexity is reduced, but heat dissipation effectiveness deteriorates under high power density conditions
Solution Approach 1:
The patent employs liquid cooling instead of air cooling, utilizing a fluid circulation system to transport heat away from high-power-density components. This hydraulic approach provides superior heat dissipation effectiveness compared to conventional air cooling methods, efficiently managing thermal loads in high-performance computing systems.
3Reliability
If cooling is optimized for one side of the PCB, then cooling effectiveness improves for that side, but the other side experiences thermal management deficiencies
Solution Approach 1:
The cooling system is segmented into multiple heat sinks that can be selectively applied to different sides of the PCB. This segmentation allows independent optimization of cooling effectiveness for each side while maintaining the capability to manage thermal loads across the entire board.
Solution Approach 2:
The cooling system is designed with universal applicability to both sides of the PCB. The same liquid cooling infrastructure supports heat sinks on either side, providing adaptable thermal management that can address varying power density requirements across different locations and sides of the circuit board.
4Adaptability or versatility
If flexible coolant pathways are implemented, then adaptability to varying thermal loads improves, but device complexity increases
Solution Approach 1:
The coolant pathways are designed with flexible and adjustable characteristics, allowing the system to adapt to varying thermal loads and component configurations. This dynamic capability enables efficient heat removal from different locations and power density levels while using a unified liquid cooling infrastructure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation efficiency, ensuring prolonged and stable operation in computationally intensive regimes by adapting to diverse thermal requirements and mechanical misalignments.
Implementation Method 1
The inner cavity of the first heat sink is fluidically connected to a liquid coolant distribution unit and is configured to form, together with the liquid coolant distribution unit, a first liquid coolant circulation pathway
Implementation Method 2
liquid cooling systems have emerged as a promising alternative, offering superior heat dissipation capabilities by circulating a fluid to absorb and transfer heat away from components
Data Source
AI summary
The present invention relates to the technological field of microelectronics and electronic engineering, specifically to advanced liquid-cooling-based thermal management systems for electronic components on printed circuit boards. The present invention represents a liquid cooling assembly that provides an improvement to the technological field of microelectronics and electronic engineering, by providing an effective cooling solution for systems employing vertical power delivery. Specifically, it provides liquid cooling for electronic components located on both sides of the PCB while fitting within the spatial constraints of modem electronic devices. The invention further provides a computing device that includes such an improved liquid cooling assembly, thereby improving the aforementioned technological field by increasing device operation efficiency, specifically enabling prolonged and stable operation in computationally intensive regimes due to highly efficient thermal management.