Dual-Sided Heatsink Assembly for High-Capacity Memory Modules
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Solution Overview
Problem
The challenge of effectively cooling high-capacity memory modules in high-performance computing systems, particularly for artificial intelligence/machine learning models, is not adequately addressed by existing technologies.
Innovation Solution
A heatsink design for memory and routing modules, featuring a lower and upper heatsink component with thermally conductive portions and heat dissipating elements, designed to efficiently manage heat from semiconductor chips while allowing electrical connections to a motherboard.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If external memory modules are added to increase memory capacity in high-performance computing systems, then memory capacity is improved, but heat dissipation becomes more difficult and complex
Solution Approach 1:
The patent combines the mounting structure and heat dissipation function into a single integrated heatsink assembly. The heatsink includes a lower component with a module receiving region that directly mounts the memory module, and an upper component that clamps onto the module, merging structural support and thermal management into one unified device.
Solution Approach 2:
The heatsink serves multiple functions simultaneously: it provides mechanical support for the memory module through the module receiving region, dissipates heat through thermally conductive portions and heat dissipating elements, and enables electrical connection via apertures for connection components. This multi-functional design eliminates the need for separate mounting brackets and cooling devices.
2Productivity
If high-capacity memory modules are installed to meet AI/ML computing demands, then processing performance is improved, but thermal management challenges increase
Solution Approach 1:
The heatsink is divided into a lower heatsink component and an upper heatsink component, with the module positioned between them. This segmentation allows heat to be dissipated from both the bottom and top surfaces of the memory module, effectively managing thermal loads from high-capacity memory chips.
Solution Approach 2:
The lower heatsink component acts as an intermediary between the memory module and the mounting surface. It receives the module in a dedicated receiving region and transfers heat away from the module through thermally conductive portions, preventing heat accumulation that would otherwise limit processing performance.
3Reliability
If connection components are provided on the memory module for electrical connection to the motherboard, then connectivity is improved, but the space available for heat dissipation is reduced
Solution Approach 1:
The connection components are positioned within the module receiving region of the lower heatsink component, and apertures are provided in the heatsink to accommodate these connection components. This nesting arrangement allows electrical connections to be made while the heatsink structure itself provides the heat dissipation pathway, eliminating the need to choose between connection space and cooling space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heatsink effectively dissipates heat from high-capacity memory modules, ensuring optimal operating conditions for semiconductor chips and enhancing the performance of high-performance computing systems.
Implementation Method 1
a first thermally conductive portion arranged to face the plurality of semiconductor chips disposed on the lower side of the memory and routing module
Implementation Method 2
a plurality of first heat dissipating elements configured to dissipate heat conducted from the plurality of semiconductor chips disposed on the lower side of the memory and routing module
Data Source
AI summary
A heatsink is provided for a memory and routing module with a lower and upper side, both sides having multiple semiconductor chips attached. The lower side of the module has a connection component attached for connection to a motherboard. The heatsink includes a module receiving region configured to receive a lower side of the module, including a first thermally conductive portion arranged to face the semiconductor chips, an aperture through the lower heatsink component and a thermally conductive peripheral region disposed around the module receiving region. The heatsink includes an upper heatsink component which is configured to connect to the lower heatsink component at the peripheral region to retain the module. The upper heatsink component includes a lower side. The lower side includes a second thermally conductive portion arranged to face the semiconductor chips disposed on an upper side of the module and multiple second heat dissipating elements.