Dual Sided Electronic Module Cavity Encapsulation
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Solution Overview
Problem
Dual sided electronic modules are typically thicker and require multiple process steps for encapsulation, leading to increased materials and time, and often necessitate the use of ball grid array (BGA) contacts, which occupy space and add complexity.
Innovation Solution
A method for manufacturing dual sided electronic modules with a laminate substrate featuring a cavity on the bottom surface and through holes connecting it to the top surface, allowing for single-step encapsulation using a resin under pressure, which forms a flat surface and eliminates the need for BGA contacts by using land grid array (LGA) contacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a dual sided electronic module is used to increase lateral density, then space utilization in lateral dimensions is improved, but the module thickness increases
Solution Approach 1:
The patent utilizes the vertical dimension by creating a cavity within the substrate thickness to house the second component, rather than extending the overall module thickness. This allows dual-sided mounting while maintaining a compact profile by exploiting internal substrate volume.
Solution Approach 2:
The second component is nested within a cavity formed in the substrate, effectively placing one structure inside another. This nesting approach allows the second component to be mounted on the bottom surface while occupying minimal external space, thus reducing overall module thickness.
2Reliability
If multiple process steps are used to encapsulate two dies, then both components are protected, but manufacturing time and complexity increase
Solution Approach 1:
The patent combines the encapsulation of both the first and second components into a single molding process. By designing the mold to access the cavity through holes in the substrate, both components are encapsulated simultaneously in one step, eliminating the need for separate encapsulation processes.
Solution Approach 2:
The substrate acts as an intermediary structure that provides access pathways (through holes) to the cavity containing the second component. This allows the encapsulant to reach and protect both components through a single access point, simplifying the manufacturing process.
3Reliability
If BGA contacts are used to prevent die contact with PCB surface, then electrical connection is ensured, but module width and complexity increase
Solution Approach 1:
The patent extracts the elevation function from separate BGA contacts and integrates it into the encapsulant material itself. The encapsulant forms a raised structure that naturally prevents the second die from contacting the PCB surface, eliminating the need for additional BGA contact elements.
Solution Approach 2:
The encapsulant serves multiple functions: it protects the components from environmental damage, provides structural support, and simultaneously acts as the elevation mechanism to prevent die contact with the PCB surface. This multi-functionality eliminates the need for separate BGA contacts.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the height and overall width of the module, simplifies the manufacturing process, and eliminates the need for BGA contacts, enabling higher component density without increasing thickness, similar to single sided modules.
Implementation Method 1
The encapsulant is a resin and is applied under a pressure between about 600 pounds per square inch (psi) and about 750 psi
Data Source
AI summary
A method for making a dual sided electronic module. A substrate has a first surface that is substantially parallel to a second surface. The second surface forms a cavity extending into an interior portion of the substrate. The substrate has at least one through hole connecting the cavity to the first surface. A first component is mounted with respect to the first surface, and a second component is mounted at least partially within the cavity. An encapsulant is applied to the first surface and through the at least one through hole into the cavity about the second component.